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FR4 Gold Immersion PCB Industrial Control Printed Circuit Board 6 Layer
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 14-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Surface Finish: | HASL, ENIG, OSP | Layer: | 16L |
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| Material: | FR-4 | Thickness: | 0.2-5.0mm |
| Application: | Industrial Control | Layers: | 2-16 |
| Internal Model: | C42802DC14A0 | Testing: | Flying Probe Test |
| Min. Hole Size: | 0.1mm | Min. Line Width/Spacing: | 3mil |
| Copper Thickness: | 1-3oz | Surface Mount Capability: | Yes |
| Max. Panel Size: | 600mm X 1200mm | Min. Solder Mask Bridge: | 0.08mm |
| Min. Silkscreen Bridge: | 0.08mm | ||
| Highlight: | FR4 Industrial Control Printed Circuit Board,Gold Immersion Industrial Printed Circuit Board |
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Product Description
FR4 gold immersion 6-layer industrial control board PCB
product Description:
FR4 Immersion Gold 6-Layer Industrial Control PCB denotes a printed circuit board specifically engineered for industrial control systems. As a critical component in industrial automation infrastructure, it is integrated into equipment such as industrial automation devices, machinery, and controllers, facilitating core functions including electrical signal transmission, control command execution, and power distribution.Industrial control PCBs impose stringent design criteria, mandating superior reliability, durability, and adaptability to complex operating environments. Consequently, they entail specialized specifications for key aspects including material selection, design engineering, and manufacturing processes.
product Features:
- High reliability
- Withstand high temperatures and anti-interference capability
- Durability and long life
- Support high-density integration and multi-layer design
- Moisture resistance and water resistance
- Adapt to high power demand
Manufacturing process:
- Manufacturing Process: Circuit Design and Layout: Industrial control PCB design necessitates comprehensive considerations encompassing power management, signal integrity, and electromagnetic interference (EMI) mitigation. Circuit layouts require rational planning to ensure robust electrical connectivity throughout the system.
- Material Selection: High-performance base materials are typically employed for industrial control PCBs, including high-temperature-resistant substrates and glass fiber-reinforced epoxy resins. These materials are selected to guarantee stability in harsh environments characterized by high temperatures, high humidity, and chemical corrosion.
- Multilayer Design and Stacking Technology: A multilayer structure is commonly adopted for industrial control PCBs, where multiple circuit layers are integrated through precise stacking. This approach enables high-density wiring while minimizing signal interference and optimizing spatial utilization.
- Thermal Management Design: To prevent overheating during high-power operation, industrial control PCBs incorporate specialized heat dissipation measures. These include heat pipes, heat sinks, and thermally conductive materials, engineered to facilitate timely and efficient heat dissipation.
- Protective Coating and Encapsulation: To enhance resistance against moisture, dust, and chemical corrosion, industrial control PCBs are often treated with protective coatings (such as polyurethane and epoxy resin) or subjected to specialized encapsulation techniques.
- Testing and Verification: Throughout the production cycle, industrial control PCBs undergo rigorous electrical testing, functional validation, and environmental adaptability assessments. These procedures are implemented to ensure the final product meets stringent reliability and stability standards.
