4 Layer Custom Black Solder Mask ENIG PCB Suittable for Wireless Communication

XingQiang Custom PCB Manufacturing & Prototype Service:

This is a high-precision 4-layer RF wireless printed circuit board with ENIG immersion gold surface finish and black solder mask, designed for IoT, Bluetooth, WiFi and communication modules. It features optimized power and ground layers for stable signal transmission, strong anti-interference performance, and supports QFP assembly. Ideal for industrial IoT, smart devices and consumer electronics. We provide custom PCB prototyping, small-batch fabrication and turnkey services compliant with RoHS, IPC and international quality standards.

Key Advantages of Our 4-Layer Custom PCB:

• Stable RF & Signal Performance:4-layer stackup with dedicated ground and power layers ensures clean signal transmission, low interference, and reliable performance for Bluetooth, WiFi, and wireless communication modules.
• Premium Surface Finish:ENIG (immersion gold) provides flat, oxidation-resistant pads, excellent solderability, and long-term reliability, especially for fine-pitch QFP components.
• Strong Anti-Interference Design:Optimized layer structure effectively reduces noise, crosstalk, and electromagnetic interference, making it suitable for sensitive wireless and IoT applications.
• High Compatibility & Integration:Supports compact component layout, power management circuits, RF PA, and sensor modules, ideal for smart wearables, consumer electronics, and IoT devices.
• Industry-Compliant Quality:Manufactured in line with IPC standards and RoHS compliant, ensuring safety, environmental protection, and market access for global sales.

Main manufacturing processes:

• Requirement & File Review
• We evaluate customer Gerber files, BOM, layer stackup, surface finish and application needs to confirm technical feasibility and production standards.
• Engineering & CAM Processing
• Engineers optimize PCB layout, adjust impedance, drill planning and generate production data to ensure RF signal integrity.
• Core Fabrication
• Multi-layer lamination, precision drilling, copper plating, etching and via filling to form stable 4-layer structure.
• Surface Treatment & Solder Mask
• Apply black solder mask and ENIG immersion gold finish for flat pads, strong solderability and oxidation resistance.
• Testing & Quality Control
• Electrical testing, impedance verification, AOI inspection and IPC standard compliance check to guarantee reliability.
• Packaging & Delivery
• Final inspection, anti-static packaging and on-time delivery for prototypes, small batches and mass production.

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