4 Layer Green Oil OSP Rigid Flex PCB Customized Board for Electronic devices
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
|---|---|
| Price: | NA |
| Delivery Time: | 15-16 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Features: | Gerber/PCB File Needed | Product Name: | Rigid Flex PCB |
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| Min Hole Size: | 0.1mm | Board Thickness: | 0.2-5.0mm |
| Pcb Size: | Customized | Insulation Materials: | Organic Resin |
| Dimension: | Customized | Stiffener Options: | Polyimide,FR4 |
| Components: | SMD, BGA, DIP, Etc. | Solder Mask Color: | Green/Red/White/Yellow/Black/Blue |
| Highlight: | 4 Layer Structure Rigid Flex PCB,Soft And Hard Combination PCB Board,OSP Flexible Rigid Pcb |
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Product Description
4-layer OSP Soft and Hard Combination Board PCB
Green solder mask & OSP flexible-rigid PCB integrates rigid and flexible substrates, delivering structural stability and bendability. The green mask shields copper traces from oxidation and scratches; OSP coating ensures excellent solderability without halogen. Ideal for compact, high-reliability applications like consumer electronics and automotive systems.
Basic Process Overview
- Material preparation: Selecting flexible substrates (e.g., polyimide) and rigid materials (e.g., FR-4)
- Layer processing: Creating inner layer patterns, drilling, and plating
- Lamination: Combining FPC and PCB layers through thermal pressing
- Final processing: Drilling, surface treatment, and quality control
What documents are needed for custom circuit board manufacturing?
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
Noted:Normally,Gerber files includes: PCB thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.
We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.
Basical Features:
- The 4-layer structure provides more routing space, allowing for the separation design of power, ground, and signal layers, which can meet the routing requirements of circuits of medium and small sizes (such as electronic devices containing multiple modules interaction), and is more suitable for products with higher functional integration than 2-layer boards
- Independent ground and power planes can reduce signal interference (such as EMI, RFI), lower signal transmission loss, and improve the stability of high- or sensitive signal transmission, suitable for scenarios with high requirements for signal quality (such as communication modules, sensor circuits).
- The bending and folding characteristics of the flexible parts are retained, and it can be assembled in three dimensions in narrow or irregular spaces (such as wiring inside drones, wearable devices), while the four-layer structure can carry more functions within a limited volume, balancing space constraints and performance requirements.
- The laminated structure of the 4-layer board enhances the mechanical strength of the overall rigid part, with better impact and vibration resistance than the 2- board; the flexible part uses polyimide and other substrates, which not only has high temperature resistance (-40℃ to 125℃ common range) but also has chemical resistance, adapting to complex working environments.
- The organic protective film formed by OSP is uniform and thin, which can effectively prevent the oxidation of the copper surface, ensure the good wetting of theer with the copper surface during welding, reduce the problems of false soldering, bridging, etc., improve the reliability of the solder joint, and is especially suitable for welding of precision components.

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