10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

Detalhes do produto:

Marca: Xingqiang
Certificação: ROHS,ISO,UL,IATF
Model Number: As Per Customer's Model

Condições de Pagamento e Envio:

Minimum Order Quantity: Sample,1 Pc(5 Square Meters)
Preço: Based On Gerber Files
Packaging Details: Carton Or As Your Request
Delivery Time: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
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Informação detalhada

Tipo de PCB: PCB multicamadas personalizados Min Line Space: 3mil
BGA PCB: Sim Tamanho mínimo do orifício: 0,1mm
contagens da camada: 1-30L Cobre em geral: 0.5-5oz
SMT DIP Assembléia: Apoiar Espessura da placa: 0,2-5,0 mm
Preço: Gerber Files,BOM List Lenda: Branco, preto, amarelo, vermelho
teste: Remessa prévia de teste elétrico 100% Cor da máscara de solda: Verde, vermelho, azul, preto, branco, amarelo
Destacar:

10-layer HDI PCB with ENIG finish

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Custom multilayer PCB blind buried hole

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High density PCB immersion gold process

Descrição de produto

XingQiang High-Tg Multi-layer HDI PCB for AI Vision Applications:

XingQiang provides custom PCB services for high-performance AI vision boards like RV1126B. We support multi-layer HDI design, ENIG surface finish, high-Tg FR-4 material, and strict impedance control to ensure stable signal transmission, strong anti-interference, and wide temperature resistance. Ideal for smart security, industrial vision, edge AI computing and IoT devices.


Technical Parameters:

PCB Type Custom Multilayer PCB
SMT DIP Assembly Support
Min Line Space 3mil
PCBA Standard IPC-Class 2
Copper Overall 0.5-5oz
Board Thickness 1.6mm or Tailored
Solder Mask Color Green, Red, Blue, Black, White, Yellow
Base Material FR4/FR4 High TG/FR4 Black Core/
Via Type Through-hole, Blind, Buried, Microvias
Test 100% Electrical Test Prior Shipment
Shipping Method DHL, UPS, FEDEX Or As Per Your Request


Documentation Checklist for Custom PCB Manufacturing:

• Gerber files (including layers, drill, solder mask, silkscreen)
• PCB BOM list (components, specifications, quantity)
• Pick and place file/XY coordinates for SMT assembly
• Schematic diagram (for DFM review and verification)
• PCB mechanical drawing (outline, dimensions, tolerances)
• Special requirements (impedance control, HDI, blind vias, testing)


10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 0

         

          Factory showcase

10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 1


          PCB Quality Testing


10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 2


    Certificates and Honors

10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 3



10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 4

Avaliações e Comentários

Classificação geral

5.0
Com base em 50 avaliações para este fornecedor

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Todos os comentários

A
Amady
Mali Mar 19.2026
The surface finish is uniform and consistent, free from oxidation or blackening, featuring high pad flatness and strong soldering reliability.
A
Alizeh
Pakistan Feb 27.2026
This project was extremely urgent, but fortunately the supplier was able to meet the delivery deadline.
C
Cooper
Austria Mar 8.2025
Upon receiving the order, I noticed that two of the circuit boards had slight exposed copper at the edges of the solder mask. After contacting customer service, they quickly sent replacements. Their after-sales service is commendable.

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