10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

Detail produk:

Nama merek: Xingqiang
Sertifikasi: ROHS,ISO,UL,IATF
Model Number: As Per Customer's Model

Syarat-syarat pembayaran & pengiriman:

Minimum Order Quantity: Sample,1 Pc(5 Square Meters)
Harga: Based On Gerber Files
Packaging Details: Carton Or As Your Request
Delivery Time: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Harga terbaik bicara sekarang

Informasi Detail

Jenis PCB: PCB Multilayer yang disesuaikan Ruang garis min: 3 juta
PCB BGA: Ya Ukuran lubang minimum: 0,1 mm
Hitungan Lapisan: 1-30L Tembaga secara keseluruhan: 0,5-5oz
Majelis SMT DIP: Mendukung Ketebalan papan: 0,2-5,0 mm
Harga: Gerber Files,BOM List Legenda: Putih, Hitam, Kuning, Merah
Tes: 100% Uji Listrik Pengiriman Sebelumnya Warna Masker Solder: Hijau, merah, biru, hitam, putih, kuning
Menyoroti:

10-layer HDI PCB with ENIG finish

,

Custom multilayer PCB blind buried hole

,

High density PCB immersion gold process

Deskripsi Produk

XingQiang High-Tg Multi-layer HDI PCB for AI Vision Applications:

XingQiang provides custom PCB services for high-performance AI vision boards like RV1126B. We support multi-layer HDI design, ENIG surface finish, high-Tg FR-4 material, and strict impedance control to ensure stable signal transmission, strong anti-interference, and wide temperature resistance. Ideal for smart security, industrial vision, edge AI computing and IoT devices.


Technical Parameters:

PCB Type Custom Multilayer PCB
SMT DIP Assembly Support
Min Line Space 3mil
PCBA Standard IPC-Class 2
Copper Overall 0.5-5oz
Board Thickness 1.6mm or Tailored
Solder Mask Color Green, Red, Blue, Black, White, Yellow
Base Material FR4/FR4 High TG/FR4 Black Core/
Via Type Through-hole, Blind, Buried, Microvias
Test 100% Electrical Test Prior Shipment
Shipping Method DHL, UPS, FEDEX Or As Per Your Request


Documentation Checklist for Custom PCB Manufacturing:

• Gerber files (including layers, drill, solder mask, silkscreen)
• PCB BOM list (components, specifications, quantity)
• Pick and place file/XY coordinates for SMT assembly
• Schematic diagram (for DFM review and verification)
• PCB mechanical drawing (outline, dimensions, tolerances)
• Special requirements (impedance control, HDI, blind vias, testing)


10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 0

         

          Factory showcase

10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 1


          PCB Quality Testing


10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 2


    Certificates and Honors

10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 3



10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process 4

Peringkat & Ulasan

Peringkat Keseluruhan

5.0
Berdasarkan 50 ulasan untuk pemasok ini

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Semua Ulasan

A
Amady
Mali Mar 19.2026
The surface finish is uniform and consistent, free from oxidation or blackening, featuring high pad flatness and strong soldering reliability.
A
Alizeh
Pakistan Feb 27.2026
This project was extremely urgent, but fortunately the supplier was able to meet the delivery deadline.
C
Cooper
Austria Mar 8.2025
Upon receiving the order, I noticed that two of the circuit boards had slight exposed copper at the edges of the solder mask. After contacting customer service, they quickly sent replacements. Their after-sales service is commendable.

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