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상세 정보 |
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| 실크 스크린: | 흰색, 검은 색, 노란색 | 이사회 사고방식: | 1.6mm |
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| 보드 두께: | 0.2mm-5.0mm | 표면 마무리: | HASL/OSP/ENIG |
| 테스트 방법: | 날아다니는 탐침 | 레이어: | 2-30 |
| 재료: | FR4 | 보드 크기: | 맞춤형 |
| 강조하다: | Green solder mask industrial PCB,HASL finish control PCB,Flying probe tested industrial PCB |
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제품 설명
Industrial Control PCB Customized Board:
Main Features:
- Focus on Harshness: Industrial PCBs prioritize survival and function under conditions (heat, cold, dust, moisture, vibration, electrical noise) that would quickly degrade consumer or commercial electronics.
- Reliability is Paramount: Every characteristic (materials, design, protection) aims for near-zero failure rates and continuous operation (24/7).
- Long-Term Perspective: Design and component sourcing ensure the board remains functional and supported for many years, often exceeding a decade.
- Industrial Ecosystem Integration: Built-in support for standard industrial interfaces and communication protocols is essential for connectivity.
- Certification & Compliance: Adherence to strict industrial safety and EMC standards is non-negotiable.
Industrial Control Board PCB Fabrication Process :
1. Design Data Transfer & DFM Check: The process begins with engineers submitting the Gerber files (design blueprints). The manufacturer conducts a Design for Manufacturability (DFM) check to ensure the design meets production tolerances.
2. Inner Layer Imaging & Etching: For multilayer boards, the circuit pattern is transferred onto the copper-clad laminate using a photoresist and UV light. Unwanted copper is then chemically etched away.
3. Lamination: The inner layers, insulating prepreg, and copper foil are stacked and bonded together under intense heat and pressure to form a solid board core.
4. Drilling & Plating (Vias): Precise drilling creates holes for component leads and vias (inter-layer connections). The hole walls are then plated with copper (electroless plating) to create electrical pathways between layers.
5. Outer Layer Imaging & Etching: The final circuit patterns are defined on the outer surfaces.
6. Solder Mask Application: A protective polymer layer (solder mask) is applied and cured, covering all traces except for the component pads.
7. Silkscreening: Component labels, logos, and reference designators are printed onto the board surface.
8. Surface Finish: A protective metallic finish (e.g., ENIG or HASL) is applied to the exposed copper pads to prevent oxidation and ensure solderability.
9. Electrical Testing & Profiling: The completed board is tested for opens and shorts (E-test). Finally, the large panel is cut (profiled) into individual PCBs.
