Customizable Board Thinkness PCB FR4 Multilayer Design HASL Treatment

Customized FR4 Multilayer Layer PCB

This high-performance multilayer PCB is expertly engineered to deliver exceptional electromagnetic compatibility (EMC), significantly reduced signal crosstalk, and improved signal integrity. Its multi-layer structure with premium dielectric materials isolates sensitive signal paths, ensuring stable high-frequency transmission. Ideal for advanced electronics: high-efficiency power supplies, 5G communication modules, rugged industrial controls, and compact embedded systems, meeting stringent technical demands for reliability and precision.

Advantages of Multilayer PCB:

• Increase circuit board density
• Reduce size
• Better signal integrity
• Adapt to high-frequency applications
• Better thermal management
• Higher reliability

Basical Features:

• Multi-layer design
• Inner layer and outer layer
•  through hole
• Copper layer
• Dielectric layer (dielectric material)

Multilayer PCB Customized services:

Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Tips:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

Manufacturing process:

• Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
• Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
• Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
•  Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).

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