1.2mm Thinkness 4 Layer PCB FR4 Multilayer Layer Design HASL Treatment

FR4 4-layer PCB

Product Description:

Designed with a standard 4-layer structure (Signal-Ground-Power-Signal), this multilayer PCB provides enhanced electromagnetic compatibility (EMC), reduced crosstalk, and improved signal integrity. Perfect for advanced electronics such as power supplies, communication modules, industrial controls, and embedded systems.

Advantages of Multilayer PCB:

• Increase circuit board density
• Reduce size
• Better signal integrity
• Adapt to high-frequency applications
• better thermal management
• Higher reliability

Product Features:

• Multi-layer design
• Inner layer and outer layer
•  through hole
• Copper layer
• Dielectric layer (dielectric material)

Manufacturing process:

• Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
• Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
• Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
•  Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).