Double Sided OSP Soft And Hard Combined PCB Board Customized services

Double-sided OSP soft and hard combined board PCB

I. Structural and Design Advantages

• Flexible adaptation to space constraints: The rigid-flex feature allows it to bend and fold in narrow, irregular spaces, making it suitable for scenarios requiring three-dimensional assembly (such as internal wiring of wearable devices and medical instruments). Compared to pure rigid boards, it better adapts to complex structural designs.
• Simplified assembly process: It reduces the use of connectors between traditional rigid and flexible boards, lowers the risk of failures caused by poor connector contact, and simultaneously shortens the assembly time and the overall product volume.
• Simplicity of 2-layer structure: For scenarios with low circuit complexity, the 2-layer design is sufficient to meet requirements, avoiding the design redundancy of multi-layer boards and reducing design difficulty and error probability.

II. Performance and Reliability Advantages

• Excellent soldering performance: The organic film formed by OSP surface treatment is uniform and thin, which can effectively protect the copper surface from oxidation, ensure good wetting between solder and the copper surface during soldering, reduce issues like cold solder joints and false soldering, and improve soldering reliability.
• Stable signal transmission: The wiring of the 2-layer structure is relatively simple with clear signal paths, reducing potential signal interference problems that may occur in multi-layer boards. Meanwhile, the conductor continuity in the rigid-flex part is good, resulting in low signal transmission loss.
• Strong environmental adaptability: OSP treatment provides stable protection in normal temperature and humidity environments. Additionally, the base materials of the rigid-flex part (such as polyimide in the flexible section) have certain temperature resistance and impact resistance, adapting to various working environments.

III. Cost and Production Advantages

• Lower production costs: The 2-layer board uses fewer materials and involves fewer processing procedures (such as lamination and drilling) compared to multi-layer boards. The process complexity of the rigid-flex part is also lower than that of high-multi-layer rigid-flex boards, leading to overall lower manufacturing costs.
• Shorter production cycle: The simplified procedures reduce waiting time in the production process, and the OSP surface treatment takes less time than treatments like electrolytic nickel-gold plating, which helps shorten the product delivery cycle.
• High material utilization: The 2-layer structure design is more concise, resulting in less material waste during board cutting and wiring, which is especially suitable for economical products produced in batches.