Gold Plated Flexible Rigid PCB Board 4 Layer FR4 Circuit Board OEM Service
Product Details:
Place of Origin: | China |
Brand Name: | xingqiang |
Certification: | ROHS, CE |
Model Number: | Varies by goods condition |
Payment & Shipping Terms:
Minimum Order Quantity: | 5 square meters |
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Price: | NA |
Delivery Time: | 15-16 work days |
Payment Terms: | ,T/T,Western Union |
Supply Ability: | 3000㎡ |
Detail Information |
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Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
Materila: | FR4 | Product: | Print Circuit Board |
Highlight: | Gold Plated Flexible Rigid PCB Board,Gold Plated FR4 Circuit Board |
Product Description
4-layer gold-plated flexible-rigid PCB
Advantages of Rigid-Flex PCB:
- Optimize space and size
- Reduce the use of connectors and cables
- Adapt to complex spatial layout
- High reliability
- High temperature resistance and chemical resistance
- Reduce electrical interference
product Description:
4-layer gold-plated flexible-rigid PCB is a printed circuit board that combines the characteristics of rigid PCB and flexible PCB. It combines rigid PCB and flexible PCB designs to create a circuit board that has the structural strength of a rigid board with the flexibility of a flexible board. Rigid-flex PCB can achieve more circuit connection options, and also has high mechanical strength and good flexibility, which is suitable for application scenarios that require the advantages of both rigidity and flexibility.
Manufacturing process:
- Design and material selection: During the design phase, it is necessary to clarify which parts need to be rigid and which parts need to be flexible. App base materials (such as FR4, polyimide) and processes should be selected to ensure good integration of rigid and flexible parts..
- PCB lamination: The manufacturing of rigid-flex PCBs requires the lamination of rigid and flexible parts, which usually involves precise hot pressing and bonding to combine different material circuit layers into a complete PCB.
- Etching and hole processing: Photolithography and etching are performed on the laminated PCB to form the desired circuit pattern, and hole processing is out for component mounting and interconnection between different circuit layers.
- Surface treatment: Surface treatment processes (such as gold plating, tin HASL, OSP, etc.) are used to protect the surface of the circuit, ensuring its good solderability and anti-oxidation capability.
- Assembly and testing: After completing the circuit board, perform component placement or plug-in welding, and conduct electrical testing to ensure that the circuit functions normally and the design requirements.