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White Oil Sinking Gold 4 Layer Rigid Flex PCB Board Stable Performance Customized
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 15-16 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Solder Mask Color: | Green | Solder Mask Colour: | Black Solder Mask |
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| Layers: | 4 | Outline Tolerance: | ±0.1mm |
| Pcb Standard: | IPC-A-610 E | Application: | Solid State Drive |
| Min. Line Width/Spacing: | 0.075mm | Finished Copper: | 1oz |
| Material: | Polyimide | Treatment: | ENIG/OSP/Immersion Gold |
| Panel: | Customized | Other Service: | PCB Assembly, Prototype Order |
| Highlight: | Sinking Gold Rigid Flex PCB,Rigid Flex PCB Board 4 Layer,6x2cm Rigid Flex PCB Board |
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Product Description
White oil sinking gold 4-layer soft and hard combination plate PCB
The 4-layer gold immersion rigid-flex PCB combines the characteristics of multi-layer structure, gold immersion treatment and rigid-flex design, with the following notable advantages: In terms of structure and design, the 4-layer layout provides sufficient wiring space, enabling reasonable partitioning of power, ground and signal layers to meet the integration needs of medium and high complexity circuits. The rigid-flex feature allows it to ensure overall structural stability through the rigid part, while adapting to narrow and irregular assembly spaces by virtue of the bending and folding ability of the flexible part, reducing the use of connectors and simplifying the assembly process. In terms of performance, the gold layer formed by gold immersion surface treatment is uniform and dense, with excellent oxidation resistance and wear resistance, which can maintain good solderability for a long time, especially suitable for high-frequency plugging or precision welding scenarios. Moreover, the gold layer has good conductivity, which can improve the signal transmission efficiency. In addition, the gold immersion process has high stability, which can ensure the consistency of the surface performance of the board and reduce the production defect rate. Compared with high-order multi-layer boards, the 4-layer structure makes material costs and processing difficulties more controllable under the premise of meeting performance requirements. Combined with mature rigid-flex technology, the production cycle is relatively controllable, making it suitable for mass production. It is widely used in communication equipment, precision instruments, automotive electronics and other fields.
Product Features:
| Feature Category | Specification | Details |
| Layer Structure | Number of layers | 4 layers (2 flexible + 2 rigid) |
| Material composition | Fr4 (rigid) + PI (flexible) | |
| Physical Properties | Board thickness | 1.0mm (rigid) + 0.15mm (flexible) |
| Copper thickness | 35μm (outer layer), 35μm (inner layer) | |
| Surface finish | ENIG (Electroless Nickel Immersion Gold) | |
| Circuit Design | Line width/space | 6/6 mil (min) |
| Solder mask | Green solder mask (rigid area), Coverlayer (flexible area) | |
| Functional Features | Flexibility | Flexible areas allow bending/folding |
| Rigidity | Rigid areas provide mechanical support | |
| PTH (Plated Through Holes) | Electrical connection between layers |
Appplication:
- Consumer electronics: Smartphones (connecting components like cameras, flashlights, and fingerprint sensors), foldable screen devices (enabling flexible screen unfolding and folding), wearables (e.g., smartwatches and health monitoring bands), and TWS earbuds (compact design with high-density interconnects).
- Medical devices: Endoscopes (precise image transmission and operation), pacemakers (reliable signal transmission in compact spaces), and portable diagnostic equipment (high-precision and miniaturized designs).
- Automotive electronics: In-vehicle displays, sensors, battery management systems (BMS) for new energy vehicles, and ADAS (advanced driver assistance systems), ensuring stable operation in complex environments.
- Industrial automation: Industrial robots and sensor control modules (high-density integration and reliable performance in harsh conditions).
- Aerospace: Satellite communication equipment and flight control systems (lightweight design for high-speed signal transmission in extreme environments).
- IoT (Internet of Things): Smart home devices and edge computing equipment (efficient data transmission and high integration).
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