1.2mm Thinkness Flexible PCB with OSP Surface Treament FPC Design Customized Board

1.2mm Thinkness Flexible PCB 

  Flexible PCB is a printed circuit board that can be bent, folded, and twisted. It uses a flexible substrate (such as polyimide, polyester film, etc.) as the substrate, allowing the circuit board to be bent, twisted, and compressed without damaging the circuit. Flexible PCB has extremely high flexibility and adaptability, can adapt to complex space design and dynamic environment, and is widely used in electronic products that require thinness, high density, and flexibility.

Advantages of  Flexible PCB, FPC:

• Flexibility and high space utilization
• Adapt to dynamic applications
• Reduce wiring and welding requirements
• High signal integrity and low interference
• Light weight, thin thickness
• Manufacturing process is mature

Product Features:

• Flexibility and bendability
• High-density integration
• Reduce size and weight
• Adapt to complex shapes
• High reliability
• Excellent thermal conductivity and chemical resistance

Manufacturing process:

• Substrate selection: Flexible PCBs typically use polyimide (PI) or polyester film (PET) as the substrate, which offers excellent flexibility, temperature resistance, and chemical corrosion resistance.
• Circuit design and photolithography: The circuit pattern is transferred to the flexible substrate using photolithography technology, and then etching is performed to the unwanted copper layer, leaving the circuit pattern.
• Hole processing and electroplating: Drilling processing is carried out on flexible PCB, and electroplating process is adopted to make the inner wall the hole conductive, usually using blind hole and buried hole design.
• Lamination process: Flexible PCBs can be designed with single-layer, multi-layer, or double-sided layouts, and different circuit layers are stacked together using lamination process to form a circuit board with high integration.
• Surface treatment: The surface of flexible PCB is treated to improve solderability and anti-oxidation ability. Common surface treatment methods include OSP (Organic Protection), gold plating, tin plating, etc.
• Assembly and testing: After the circuit design is completed, surface-mount technology (SMT) or through-hole components are assembled, and electrical testing is performed ensure that the circuit board's performance meets the design requirements.