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6 Layer FR4 Solder Masked Multilayer PCB Board Through Hole PCB OEM Service
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 12-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
| Materila: | FR4 | Product: | Print Circuit Board |
| Highlight: | Solder Masked Multilayer PCB Board,6 Layer Through Hole PCB |
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Product Description
FR4 solder-masked 6-layer board PCB
A 6-layer FR4 solder mask PCB is a multilayer printed circuit board (PCB) based on an FR4 substrate and including its solder mask layer. Designed for complex electronic designs, this PCB consists of six layers, typically consisting of an outer copper foil layer, an inner signal layer, an inner copper foil layer, and a substrate layer. FR4 acts as an insulating core material, providing mechanical strength and electrical performance. A solder mask (usually green) covers the copper layer to prevent short circuits and oxidation, leaving only the solder pads for soldering.
Advantages of Multilayer PCB:
| Feature | Description |
| Structure | Typically consists of 6 layers: outer copper layers, inner signal/power layers, and FR4 dielectric layers, with a solder mask on top and bottom. |
| Solder Mask | The solder mask (usually green) covers the copper traces, protecting against oxidation, short circuits, and environmental damage. |
| High Density | Supports complex circuitry and dense component layouts due to multiple layers. |
| Signal Integrity | Offers good signal integrity and reduced electromagnetic interference (EMI) thanks to inner layer shielding and controlled impedance design. |
| Mechanical Strength | FR4 material provides high mechanical strength and dimensional stability. |
| Application | Commonly used in complex electronic devices such as computers, industrial controls, and communication equipment. |
| Cost & Complexity | Higher manufacturing cost and design complexity compared to simpler boards. |
Product Features:
- Multi-layer design
- Inner layer and outer layer
- through hole
- Copper layer
- Dielectric layer (dielectric material)
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
- Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
- Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).
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