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Precise Circuit Wiring Rigid PCB Board Circuit Board For Electronic Products
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | KAZD |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
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| Price: | NA |
| Delivery Time: | 12-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
| Materila: | FR4 | Product: | Print Circuit Board |
| Highlight: | Precise Circuit Wiring Rigid PCB Board,Rigid Circuit Board For Electronic Products |
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Product Description
Rigid PCB
Advantages of Rigid PCB:
- Structural stability
- High temperature resistance
- High signal integrity
- Broad applicability
- Manufacturing process is mature
- Support multi-level design
product Description:
Rigid PCB (Rigid PCB) refers to a printed circuit board that uses rigid materials (such as glass fiber reinforced epoxy resin) as the substrate. This kind of circuit board is not designed to be flexible and has high hardness. It is mainly used in applications that require a stable and durable structure that will not change shape due to external forces. Rigid PCB is the most common type of PCB and is widely used in basic circuit connections and supports for electronic products.
product Features:
- Rigid structure
- High reliability
- Good mechanical strength
- Precise circuit wiring
- Lower cost
- Adapt to a variety of surface treatment processes
Manufacturing process:
- Substrate selection: The substrate for rigid PCBs typically uses FR4 (glass fiber epoxy resin) or other high-performance resins, which can provide solid structure and good electrical performance.
- Holes and plating: Holes are drilled in the PCB to connect different layers of the circuit. Then, plating is performed to ensure that inner walls of the holes have good conductivity.
- Lamination and stacking: For multilayer rigid PCBs, the lamination process is used, where multiple circuit layers are stacked and then hot- and cured, making the circuit board structure more stable.
- Surface treatment: After the circuit design is completed, surface treatment such as gold plating, tin plating, OSP, etc., is carried out to solderability and anti-oxidation capability.
- Surface treatment: Surface treatment is performed on the surface of the PCB to improve solderability and anti-oxidation capability. Common surface treatments include gold pl, tin plating, OSP, etc.
- Component welding: Finally, the surface-mount technology (SMT) or through-hole welding is performed to install electronic components onto the PCB.
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