• 1.6mm Thickness Double Sided PCB Board With Red Oil Sinking Gold Craftsmanship
1.6mm Thickness Double Sided PCB Board With Red Oil Sinking Gold Craftsmanship

1.6mm Thickness Double Sided PCB Board With Red Oil Sinking Gold Craftsmanship

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: 5 square meters
Price: NA
Delivery Time: 7-10 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 3000
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Detail Information

Board Thickness: 1.6mm Light Source: 8520 SMD
Controlled Impedance: +/-5% Application: Industry/Medical/Consumer Electronic
Layers: 1-20 Layer: 4
Surface Finish: HASL, ENIG, OSP High Tg: Tg180
Qty: 60leds Mass Production: LPJxxxxxNL
Min. Solder Mask Bridge: 0.08mm Board Thinkness: 1.6mm
Samples: Available Finish Thickness: 1.55 ±10%mm
Solder Mask: Green
Highlight:

Double Sided PCB Board 1.6mm Thickness

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Double Sided PCB Board With Red Oil

Product Description

Double-sided red oil sinking gold craftsmanship

Product Description
Double-sided red oil sinking gold craftsmanship refers to a printed circuit board manufacturing process that combines red oil solder mask with double-sided gold immersion (chemical gold plating) surface treatment. The board features a double-sided wiring design: the substrate is coated with red ink as the solder mask, which insulates and protects the circuit while providing clear visual identification of circuit areas due to its vivid color. Both sides of the board undergo gold immersion processing on exposed copper pads—first depositing a thin nickel layer as a base, then a dense gold layer on top. This craftsmanship is suitable for small to medium complexity circuits, accommodating the welding and assembly of precision components like SMT and some through-hole parts.
Core Characteristics
  • Red oil solder mask + double-sided gold immersion combination: The red ink offers stable insulation and distinct visual differentiation, while the nickel-gold composite layer on pads ensures reliable soldering performance with strong adhesion and uniform thickness.
  • Double-sided wiring structure: Supports bidirectional signal transmission, adapting to standard electronic device layouts and meeting small to medium-scale circuit design needs.
  • Process compatibility: The integration of red oil solder mask and gold immersion is stable, with good material compatibility, fitting into conventional production workflows.
Main Advantages
  • Superior soldering reliability: The gold layer on pads has excellent oxidation resistance and conductivity, ensuring consistent solder wetting, reducing cold solder joint risks, and being ideal for precision components such as BGA and QFP.
  • Clear identification and robust protection: The red solder mask simplifies production inspection and fault diagnosis through visual distinction; it also isolates circuits from external environments, enhancing corrosion resistance and extending the board’s service life.
  • High-frequency performance: The flat gold layer surface minimizes signal transmission loss, making it suitable for high-frequency scenarios in communication equipment and medical instruments.
  • Balanced cost and performance: Compared to high-end surface treatments, it maintains good performance with relatively controllable costs, suitable for fields requiring precision and clear identification, such as consumer electronics and industrial control.


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