Custom Green Solder Mask HDI Rigid Board PCB FR-4 High-TG Material Competitive Price

Product Details:

Brand Name: Xingqiang
Certification: ROHS, CE,UL,ISO,IATF
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: NA
Delivery Time: 14-15 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
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Detail Information

Product Name: HDI Rigid Board UL Certification: Yes
Layer: 1-30 Min. Hole Size: 0.1mm
Base Material: FR4 Suface Finish: HASL
Quotation Docunment: Gerber Files Regular Thickness: 1.6/1.2/1.0/0.8
Feature: Microvia Technology Silkscreen Color: White Or Customized
Highlight:

Green Solder Mask HDI PCB

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1.6mm Thickness Industrial Control PCB

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8 Layer Industrial Control PCB Board

Product Description

 Tailored HDI Rigid PCB Solutions for Mobile, Wearables, and IoT Devices

 Custom HDI Rigid PCB refers to high‑density interconnect rigid printed circuit boards manufactured to specific design requirements. These boards use advanced laser‑drilled microvias and fine‑line traces to achieve higher component density and better electrical performance than standard PCBs. They are widely used in smartphones, tablets, wearables, and other compact electronic devices where space is limited. Customization includes choosing layer count, material type, trace width/spacing, via structure, surface finish, and other parameters to meet exact application needs.


Key Features and Characteristics

  • Multi-Layer Stack-up: This configuration allows for complex routing and effective separation of power, ground, and signal layers, which is crucial for signal integrity and noise reduction in industrial settings.

  • High-Density Interconnect (HDI) Technology: The use of microvias, buried vias, and blind vias enables a much higher component density than a conventional board. This results in a smaller, more compact design without sacrificing functionality.

  • Robust Materials: Industrial control boards are built to withstand harsh conditions. They use durable materials that can handle mechanical stress, temperature fluctuations, and exposure to dust, chemicals, and vibration.

  • Signal Integrity: The multi-layer design, combined with HDI technology, ensures excellent signal integrity. This is vital for high-speed digital signals, preventing data loss and communication errors in complex control systems.

  • Thermal Management: The board's design often includes features for efficient heat dissipation, which is critical for components operating under high power in enclosed spaces.


Main Applications

  • Factory Automation: They are the "brains" of automated assembly lines, robotic arms, and CNC machines, controlling every movement and process.

  • Motor Control Systems: Used in variable frequency drives (VFDs) and other motor controllers to precisely manage the speed and torque of industrial motors.

  • Power and Energy Systems: Found in power distribution units, smart grid technology, and other energy management devices.

  • Heavy Machinery: Integrated into construction equipment, agricultural machinery, and other heavy-duty vehicles to manage their electronic systems.


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Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this product

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
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All Reviews

Z
Zayed
United Arab Emirates Jan 7.2026
The board is thin but very sturdy; the multi-layered structure is tightly compressed with no delamination.

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