Custom 6-Layer HDI PCB for Automotive Green Solder Mask ENIG/HASL LF Surface Finish

How to Get an Accurate PCB Quotation: Gerber & BOM Files?

To facilitate an efficient and accurate quotation process, we require detailed input from our clients, including Gerber files and a BOM (Bill of Materials) list. 

The Gerber files provide the exact design specifications of the PCB, including layout, drill data, and layer information, enabling us to precisely manufacture your boards.

The BOM list outlines all components required for assembly, ensuring that we source the correct parts and assemble your board according to your design intent. By providing these files, you help us deliver a seamless, error-free manufacturing and assembly experience.

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Automotive PCB Manufacturing Process 

1. Design & Pre-production:
• The design data is input into Computer-Aided Manufacturing (CAM) systems.
• Film Generation: Phototools (or films) are created for imaging the circuit pattern on the copper panels.
• 2. Core Material Preparation:
• Cutting: The copper-clad laminate (the core material) is cut to the required panel size.
• 3. Drilling:
• Drilling: Holes are drilled for component leads and vias (interlayer connections).
• 4. Electroless Plating & PTH (Plated Through Hole):
• Desmearing/Cleaning: The inside of the drilled holes is cleaned.
• PTH: A thin layer of copper is chemically deposited in the holes to make them conductive.
• 5. Imaging (Pattern Transfer):
• Dry Film Lamination: A photosensitive dry film resist is applied to both sides of the panel.
• Exposure: The panel is exposed to UV light through the phototools to transfer the circuit pattern onto the resist.
• Developing: The unexposed (or exposed, depending on the resist type) resist is removed, leaving the copper pattern exposed where the circuits will be.
• 6. Etching & Plating (Pattern Plating):
• Electroplating: Copper is electroplated onto the exposed circuit pattern and inside the holes.
• Tin Plating: A thin layer of tin (or another etch-resistant material) is plated over the copper circuit traces.
• Stripping: The remaining dry film resist is chemically stripped away.
• Etching: The exposed, unwanted base copper (not protected by the tin layer) is chemically etched away.
• 7. Solder Mask & Legend:
• Solder Mask Application: A liquid solder mask (usually green) is applied, exposed, and developed to only cover the circuitry, leaving pads and holes exposed for soldering.
• Legend/Silkscreen: The component designators and markings (legend) are printed onto the board.
• 8. Surface Finish & Final Testing:
• Surface Finish: A final protective metallic layer (e.g., HASL, ENIG) is applied to the exposed copper pads to ensure solderability.
• Electrical Test (E-Test): The board is tested for continuity and isolation (shorts and opens).
• Routing/Profiling: The individual PCBs are cut out of the larger panel.
• Final Inspection: The board undergoes a final quality check.

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