Custom Flex Rigid PCB Solutions

PCB production
January 29, 2026
Category Connection: Rigid Flex PCB
Brief: Step into our short showcase to explore the solution's standout capabilities. In this video, we demonstrate our custom flex-rigid PCB solutions featuring ENIG coating and BGA pad designs. You'll see how we integrate circuits with stiffener frames and learn about our Gerber-based manufacturing process that supports complex component assembly for high-performance applications.
Related Product Features:
  • Custom high-performance flex-rigid PCBs with integrated component assembly.
  • Combines ENIG-finished rigid FR-4 areas with durable polyimide flex circuits.
  • Supports integration of fine-pitch BGA chips, high-speed connectors, and EMI filters.
  • Fully customizable layer counts (1-30+ layers), pad sizes, and via types.
  • Space-saving design that eliminates connectors and cables to reduce assembly size.
  • Enhanced reliability with fewer interconnections and improved signal integrity.
  • Superior durability resistant to vibration, shock, and extreme temperatures.
  • RoHS & CE compliant with premium quality certifications including ISO 9001 and IATF 16949.
FAQs:
  • What are the main advantages of using Rigid-Flex PCBs?
    Rigid-Flex PCBs offer space-saving design by eliminating connectors and cables, enhanced reliability with fewer interconnections, superior durability against vibration and shock, flexible configuration for custom layer counts and materials, HDI support for complex circuits, and compliance with RoHS & CE international standards.
  • What customization options are available for these PCBs?
    You can fully customize layer counts from 1 to 30+ layers, pad sizes, via types including through-hole, blind, and buried vias, stiffener frames, materials, bend radius, and surface finishes like ENIG, HASL, or Immersion Tin to meet your exact mechanical and electrical requirements.
  • What file preparation is required for custom Rigid-Flex PCB manufacturing?
    Required files include Gerber files with complete layer data, drill file in Excellon format, stack-up drawing showing layer order and materials, PCB outline mechanical drawing, component placement file, BOM for assembly, and special instructions for impedance control, flex bend requirements, and test points.
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