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RoHS Certified High-Density PCB Anti-ESD Protection Tailored for Wireless Network
Product Details:
| Brand Name: | High Density PCB |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | Based on Gerber Files |
| Packaging Details: | As per Customer's Request |
| Delivery Time: | NA |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Board Name: | Custom High-Density PCB | Min Holes: | 0.1mm |
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| Impedance Control: | ±10% | Copper Overall: | 0.5-5oz |
| Outline Tolerance: | +/-0.1Mm | Board Size: | Customizable |
| Surface Finish: | ENIG,OSP,Hard Gold | Fabrication Files: | Gerber Files,BOM List |
| Regular Layer Count: | 2-Layer,4-Layer,6-Layer,8-Layer,10-Layer | Board Thickness: | 1.6mm/1.2mm/1.0mm/0.8mm Or Tailored |
| Highlight: | HD 12 Layer PCB Board,12 Layer High Density Circuit Board,1.2mm Thickness HD PCB Board |
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Product Description
Why Choose This High-Density PCB?:
1.Ultra-high integration & miniaturization – Fine traces, laser microvias, and blind/buried vias maximize wiring in limited space.2. Superior signal integrity – Impedance controlled, low-loss design ideal for high-speed/RF/wireless applications.
3. Excellent reliability – High-Tg/thermal stable substrates and ENIG finish ensure durability and consistent performance.
4. Fully customizable – Tailored layers, materials, and finishes to match your device specs and assembly needs.
Production Flow:
1.Material Preparation: Select high-performance core boards, prepregs, and copper foils suitable for HDI.
2. Inner Layer Circuit Fabrication: Use laser direct imaging (LDI) and etching to make fine inner-layer circuits.
3. Automatic Optical Inspection (AOI): Check inner-layer circuits for defects.
4. Lamination: Stack core boards, prepregs, and outer copper foils under high temperature and pressure.
5. Laser Drilling: Drill micro-vias for interlayer connection (key process for HDI).
6. Electroless Copper Plating & Electroplating: Deposit copper on via walls and circuits to achieve conduction.
7. Outer Layer Imaging & Etching: Form fine outer-layer circuits.
8. Solder Mask Application: Apply green/blue solder mask to protect circuits.
9. Surface Finishing: Apply treatments such as ENIG, immersion tin, or OSP.
10. Silk Screen & Marking: Print logos and component labels.
11. Electrical Test & Final Inspection: Test open/short circuits and inspect appearance.
12. Routing & Packaging: Separate boards and pack for delivery.
FAQ:
1.Q:How many layers can your circuit boards provide?
A:We typically provide 1-30 layer boards, and in special cases, we can stack more layers.
2. Q:Do your circuit boards support customization?
A:Yes, we support customized designs. You can send us your Gerber files and BOM list, and we will provide you with an accurate quote based on the information and market conditions.
3. Q:What do Gerber files typically contain?
A:Normally Gerber files Include:PCB Types,Product thickness, Ink color, Surface treatment process and If SMT processing is required, component BOM and tag drawing are also required.
4. Q:What is your minimum order quantity for PCB boards?
A:Our minimum order quantity is 1 piece(5 square meters),the larger the quantity, the bigger the discount.
5. Q:Do you have relevant certification certificates to support this?
A:We hold numerous important certifications, including ISO, UL, CE, and RoHS. All products undergo rigorous quality testing.
6. Q:What payment method do you usually use?
A:For small orders, samples, or urgent payments, we accept Western Union. For large orders, we recommend T/T, which ensures the safety of both parties.
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