FR4 Material Double Sided High Frequency PCB Board 1.2mm Thinkness

Double-sided high-frequency PCB

product  Description:

  Double-sided high-frequency PCB (High-Frequency PCB) refers to a printed circuit board specially designed for high-frequency signal applications. Its materials and structure are optimized to ensure good electrical performance under high-frequency operating conditions. High-frequency PCBs are commonly used in electronic equipment that require high-frequency signal transmission, such as communication systems, radio frequency (RF) equipment, radar, satellite communications, and wireless equipment.

product Features:

• High frequency performance requirements
• Low dielectric constant and low loss factor
• Signal integrity and impedance control
• Thermal management
• High frequency material characteristics

Manufacturing process:

• Design phase: In the design phase, it is necessary to use specialized PCB design software to consider the characteristics of high-frequency signal transmission, and to carry precise impedance control and signal integrity analysis.
• Material selection and manufacturing: High-frequency PCBs typically use special high-frequency materials such as PTFE, ceramics, or LCP. These materials require processing during manufacturing to ensure stable electrical performance.
• Etching and pattern transfer: The circuit pattern of high-frequency PCB is transferred to the copper layer through photolithography and etching technology. In this, the width and spacing of the lines need to be strictly controlled to ensure the stability of signal transmission.
• Via and interlayer connection: The via design of high-frequency PCBs requires great precision, using tiny vias and appropriate plating processes to ensure the transmission of signals.
• Assembly and testing: After the completion of the PCB manufacturing, the components are installed and soldered. High-frequency PCBs need to undergo strict testing to their performance under high-frequency working conditions, including signal integrity, impedance control, and thermal management, etc.