• UL 94V-0 Flammability Microwave RF Circuit Board PCB For Signal Transmission OEM
UL 94V-0 Flammability Microwave RF Circuit Board PCB For Signal Transmission OEM

UL 94V-0 Flammability Microwave RF Circuit Board PCB For Signal Transmission OEM

Product Details:

Brand Name: High Frequency PCB
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: N/A
Delivery Time: 14-15 Working Day
Payment Terms: T/T,Western Union
Supply Ability: 100000㎡/Month
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Detail Information

Pcb Type: Microwave RF Circuit Board Pcb Name: Double Sided High Frequency PCB
Final Foil: 1 Oz Flammability: Yes
Oem: Custom Smt Efficiency: BGA
Min Via: 0.1mm Laser Drill, 0.2mm Mechanic Drill Min Line Space: 3mil
Quotation Request: Gerber Files,BOM
Highlight:

OEM Microwave RF Circuit Board

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UL 94V-0 Flammability Microwave Circuit Board

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Microwave PCB For Signal Transmission

Product Description

Product Description:

The High Frequency PCB is a custom OEM product designed for applications requiring exceptional signal integrity and high-frequency signal transmission. This advanced PCB features a sleek grey color and surface finish with HASL-LF technology, ensuring superior quality and performance.

With a minimum line space of 3mil, this High Frequency PCB is optimized for ground plane optimization, a critical factor in maintaining signal integrity and reducing electromagnetic interference. The immersion gold finish (ENIG) further enhances the board's performance by providing excellent conductivity and corrosion resistance.Ground plane optimization is a key feature of this High Frequency PCB, as it helps to minimize signal distortion and ensure reliable high-frequency signal transmission. By providing a solid ground plane, this PCB is able to maintain signal integrity and reduce the impact of noise and crosstalk, resulting in a high-performance electronic system.


Features:

1.High Component Density: Accommodates more components (e.g., microchips, resistors) per unit area via fine-pitch technology, reducing overall board size.
2. Fine Line and Space (L/S): Features narrower conductive lines and smaller gaps between them, typically with L/S values below 0.1mm, enabling precise signal transmission.
3. Multi-Layer Configuration: Adopts more layers (often 8 layers or more) to optimize signal routing, isolate interference, and enhance integration.
4. Excellent Signal Integrity: Minimizes signal loss, crosstalk, and delay through advanced design and material selection, suitable for high-frequency applications.
5. High Reliability: Uses high-quality substrates and strict manufacturing processes to withstand harsh environments (e.g., temperature fluctuations, vibration) in industrial, automotive, and aerospace fields.

  


 

FAQ:

Q: What is the brand name of the high frequency PCB product?

A: The brand name of the high frequency PCB product is High Frequency PCB.

Q: Where is the high frequency PCB product manufactured?

A: The high frequency PCB product is manufactured in Dongguan,China.

Q: What Files are typically used to make circuit boards?

A: Circuit board manufacturing typically requires Gerber files and a Bill of Materials (BOM) to ensure accuracy during the production process.

Q: What are the payment terms for purchasing the high frequency PCB product?

A:  The payment terms for purchasing the high frequency PCB product are T/T.

Q: What is the supply ability of the high frequency PCB product?

A:  The supply ability of the high frequency PCB product is 200000㎡ per month.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%

All Reviews

S
Suda
Thailand Dec 15.2025
The green circuit boards purchased in bulk are slightly more expensive than those from competitors, but they excel in consistent quality and good solderability of the pads.
R
Rayyan
Saudi Arabia Dec 1.2025
There were questions regarding the design drawings, and the engineer responded within an hour, proactively optimizing the oil well completion plan. The response was timely and professional.
A
Amar
Mongolia Sep 27.2025
The resin-filled vias and tin-plating combination process is excellent! The vias are completely filled without any voids, and the surface tin plating is smooth and free of bumps. When mounting BGA chips, the fit is perfect, and there are no solder bridges or cold joints after soldering, meeting the requirements for high-density packaging.

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