1.2mm Thinkness Multilayer PCB Board Green oil Through Hole Design Customized

1.2mm Thinkness Multilayer PCB Board

Multi-layer Printed Circuit Board (PCB) refers to a printed circuit board formed by laminating three or more conductive graphic layers (copper layers) onto a substrate insulation layer through lamination technology. It serves as the core carrier for modern high-performance, high-density electronic devices.

Main Advantages

Core Applications

1. High-Speed Digital Devices
   • Smartphones/PC motherboards (6–12 layers): Impedance matching and shielding for CPU/RAM signals.
   • Servers/switches (16+ layers): Supports 25Gbps+ high-speed differential signals.
2. High-Reliability Systems
   • Automotive ECUs (8–14 layers): Vibration/temperature resistance (150°C) for powertrain control.
   • Aerospace electronics: Redundant design + ceramic substrates for extreme environments.
3. Miniaturized Devices
   • Smartwatches/TWS earphones: 4–8 layer HDI (High-Density Interconnect) boards enable component scaling.

Technical Challenges & Trends

• Design Complexity: Requires EDA tools (e.g., Cadence/Allegro) for SI/PI simulation.
• Process Limits: 5G/AI chips drive layer counts to 30+, line width/spacing ≤40μm.
• Material Innovation: PTFE (polytetrafluoroethylene) for high-frequency apps (Df Multi-layer PCBs are the foundation of electronics miniaturization and high performance—breaking physical limits via 3D circuit stacking while enabling efficient signal, power, and ground management through precision interconnects. From smartphones to supercomputers, their evolving layer counts and processes continually extend Moore’s Law, acting as the "invisible skeleton" of modern electronics.

Manufacturing process:

• Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
• Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
• Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
• Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
•  Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).