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FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 12-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
| Material: | FR4 | Product: | Print Circuit Board |
| Highlight: | OSP Surface Multilayer Printed Circuit Board,FR4 Material 4 Layer PCB Board |
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Product Description
FR4 OSP 4-layer board PCB
Product Description:
FR4 OSP 4-layer board PCB Multilayer PCB is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.
Advantages of Multilayer PCB:
| 1. Enhanced Signal Integrity | • Separates signal layers from power/ground layers, reducing crosstalk between adjacent signal traces. • Provides a dedicated reference plane (ground or power) for signal layers, minimizing signal reflection and transmission loss. |
| 2. Higher Component Density & Space Savings | • Allows routing of traces on four layers instead of two, enabling more complex circuit designs in a smaller board area. • Reduces the need for through-hole vias or jumper wires, making the board layout more compact and suitable for miniaturized devices. |
| 3. Improved Electromagnetic Compatibility (EMC) | • Dedicated power and ground layers form a stable "power-ground plane capacitor," filtering out high-frequency noise. • Isolates sensitive analog signals from noisy digital circuits by placing them on separate layers, reducing electromagnetic interference (EMI) emissions and susceptibility. |
| 4. Cost-Effectiveness for Complex Designs | • More economical than 6-layer or higher-layer PCBs when basic 2-layer boards cannot meet performance requirements. • Lowers overall system costs by reducing the need for additional external components (e.g., noise filters) that compensate for poor signal or EMC performance. |
Product Features:
- Multi-layer design
- Inner layer and outer layer
- through hole
- Copper layer
- Dielectric layer (dielectric material)
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
- Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
- Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).
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