Aluminum PCB Printed Circuit Board Corrosion Resistance For High Frequency Signals

Aluminum PCB

Advantages of Aluminum PCB PCB:

• Excellent heat dissipation performance
• Improve equipment reliability 
• Low resistance and voltage drop
• High heat resistance and high stability
• Corrosion resistance
• Suitable for high frequency signals

product  Description:

  Copper-based PCB is a printed circuit board (PCB) that uses copper as the base material. Unlike traditional aluminum substrates or FR4 boards, copper substrates can effectively manage heat in electronic devices through excellent thermal conductivity. Copper substrates are widely used in high-performance electronic equipment that requires efficient heat dissipation and high power load resistance. It is especially suitable for high-frequency signal transmission, power electronics, communication equipment and other high-power, high thermal load systems.

product Features:

• Multi-layer structure
• Thermal conductivity
• High temperature stability·
• Electrical performance

Manufacturing process:

• Copper layer deposition: The manufacturing of copper substrates typically begins with depositing copper on the surface of the substrate. A layer of copper is plated a metal substrate (such as steel, aluminum, or composite materials) through an electroplating process.
• Photolithography and etching: Use photolithography technology to transfer circuit patterns onto the copper layer, and remove the unwanted copper by chemical etching form the circuit lines of the circuit board.
• Drilling and electroplating: Holes are drilled on the copper substrate for the installation of electronic components. The hole walls after drilling need to beplated to form conductive channels.
• Insulation layer processing: An insulation layer (such as polyimide) is added between the copper layer and the metal substrate, which not only plays role of electrical isolation but also enhances the thermal conductivity efficiency, ensuring the stability of the circuit.
• Surface treatment: In order to improve weldability and anti-oxidation, copper substrates are usually treated with surface treatments such as tin spraying, goldating, silver plating, etc.
• Testing and quality control: During the production process, the copper substrate needs to undergo multiple rounds of quality inspection to ensure that its electrical performance, thermal performance mechanical performance, and other aspects meet the requirements. This includes electrical conductivity testing, thermal conductivity testing, etc.