• FR4 Material Through Hole Double Sided PCB Board For Medical Device
FR4 Material Through Hole Double Sided PCB Board For Medical Device

FR4 Material Through Hole Double Sided PCB Board For Medical Device

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: KAZD

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: NA
Delivery Time: 7-10 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 3000
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Detail Information

Solder Mask: Green, Blue, Red, Black, White Min. Hole Size: 0.2mm
Silkscreen: White, Black, Yellow Max. Panel Size: 300mm*300mm
Surface Finish: HASL, ENIG, OSP Min. Line Width/Spacing: 0.1mm/0.1mm
Testing: Flying Probe Test, X-Ray Inspection, AOI Copper Thickness: 1/2oz-3oz
Min. Panel Size: 50mm*50mm Thickness: 0.2-6.0mm
Layer: 2-8 Material: FR4
Special Technology: Blind And Buried Vias, Impedance Control, Gold Finger Application: Medical PCB
Highlight:

FR4 Material Double Sided PCB Board

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Through Hole Double Sided PCB

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FR4 PCB Board For Medical Device

Product Description

FR4 Green Soldermask HASL  Material SMT Multilayer PCB Board

 

Product Description
FR4 through-hole double-sided board PCB is a printed circuit board made of FR4 epoxy glass fiber substrate, featuring double-sided wiring and through-hole technology. The FR4 material provides a stable base with excellent mechanical and electrical insulation properties. Both sides of the board are equipped with conductive circuits, connected by metal-plated through-holes (vias) that enable electrical continuity between the two layers. It is designed to accommodate through-hole components (such as resistors, capacitors, and connectors) which are inserted into pre-drilled holes and soldered to the pads on both sides, making it suitable for small to medium complexity electronic circuits.
Core Characteristics
  • FR4 substrate foundation: Utilizes FR4 material, known for its high strength, good heat resistance (operating temperature typically -55℃ to 130℃), and stable electrical insulation, ensuring structural and performance reliability.
  • Double-sided wiring with through-holes: Two layers of conductive circuits connected by plated through-holes, enabling signal transmission between layers and supporting basic circuit integration.
  • Through-hole component compatibility: Designed for through-hole mounting, with drilled holes and corresponding pads to secure and solder traditional through-hole components.
Main Advantages
  • Cost-effectiveness: FR4 is an economical substrate material, and the double-sided through-hole design involves simpler manufacturing processes (compared to multi-layer or SMT-only boards), resulting in lower production costs, ideal for budget-sensitive projects.
  • Ease of assembly and repair: Through-hole components are easier to manually insert, solder, and replace, facilitating assembly in small-scale production or repair scenarios, especially suitable for hobbyists, prototyping, or low-volume manufacturing.
  • Mechanical robustness: Through-hole soldering creates strong mechanical bonds between components and the board, enhancing resistance to vibration and mechanical stress, making it suitable for industrial equipment or devices subject to physical impact.
  • Versatility: Compatible with a wide range of traditional through-hole components, meeting the needs of various electronic applications such as power supplies, audio equipment, and basic control circuits.

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