Black Oil Sinking Gold Thick Copper Plate PCB , FR4 Material 8 Layer PCB Board
Product Details:
Place of Origin: | China |
Brand Name: | xingqiang |
Certification: | ROHS, CE |
Model Number: | KAZD |
Payment & Shipping Terms:
Minimum Order Quantity: | 1 |
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Price: | NA |
Delivery Time: | 12-15 work days |
Payment Terms: | ,T/T,Western Union |
Supply Ability: | 3000㎡ |
Detail Information |
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Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
Material: | FR4 | Product: | Print Circuit Board |
Highlight: | Gold Thick Copper Plate PCB,FR4 Material PCB Board 8 Layer,Black Oil Sinking 8 Layer PCB |
Product Description
8 layers of black oil sinking gold thick copper plate PCB
Advantages of Multilayer PCB:
- Increase circuit board density
- Reduce size
- Better signal integrity
- Adapt to high-frequency applications
- better thermal management
- Higher reliability
product Description:
Multilayer PCB is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.
product Features:
- Multi-layer design
- Inner layer and outer layer
- through hole
- Copper layer
- Dielectric layer (dielectric material)
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
- Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
- Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).