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4 Layers Impedance-controlled Multilayer Rigid Board For Custom Communication Equipment
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE,UL,ISO,IATF |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 12-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | Multi-layer PCB | Min Hole Size: | 0.1mm |
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| Materila: | FR4 | Copper Overall: | 0.5-5oz |
| Pcba Standard: | IPC-A-610E | Pcba Customization: | BOM List |
| Minimum Line Space: | 3mil (0.075mm) | Board Size: | Customized |
| Board Thinkness: | 0.2-5.0Mm | Quotation Needed: | Gerber Files |
| Surface Finishing: | HASL/OSP/ENIG | Pcb Layer: | 2/4/6/8/10 Or Tailored |
| Highlight: | Precise Circuit Wiring Rigid PCB Board,Rigid Circuit Board For Electronic Products |
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Product Description
Rigid PCB Circuit Board for Electronic Usage
Rigid PCB refers to a printed circuit board that uses rigid materials (such as glass fiber reinforced epoxy resin) as the substrate. This kind of circuit board is not designed to be flexible and has high hardness. It is mainly used in applications that require a stable and durable structure that will not change shape due to external forces. Rigid PCB is the most common type of PCB and is widely used in basic circuit connections and supports for electronic products.
Product Features:
- Rigid structure
- High reliability
- Good mechanical strength
- Precise circuit wiring
- Lower cost
- Adapt to a variety of surface treatment processes
Do you support personalized customized services?
Yes.We support Rogers, Taconic, FR4, and custom high-Dk materials.Send us your Gerber files, stack-up requirements, and impedance specs – we’ll manufacture with precision.
Marked:Gerber files must include information such as the number of layers, board material, board thickness, copper thickness, surface finish, solder mask color, quantity, etc.
Custom Multi-layer Manufacturing process:
1.Requirement Alignment: The customer provides Gerber files (circuit design files) and specifications (e.g., immersion gold, impedance), and the manufacturer evaluates feasibility and provides a quote.
2. File Processing: Convert Gerber files into photoplotter files for production, and conduct DFM (Design for Manufacturability) checks to avoid production defects.
3. Substrate Processing: Cut the base material → drill holes → metallize the hole walls (to make holes conductive).
4. Circuit & Solder Mask Production: Create circuits via exposure and development → print the solder mask layer (green ink) → apply surface finish (e.g., immersion gold).
5. Shaping & Inspection: Rout/V-CUT the board to size → perform electrical tests (continuity, impedance) and visual inspections.
6. Packaging & Delivery: Package as per customer requirements (e.g., anti-static bags), ship the product, and provide quality inspection reports.
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