4 Layer ENIG Surface Finishing Electronic Board Custom PCB for Connector Camera Module
제품 상세 정보:
| 브랜드 이름: | Xingqiang |
| 인증: | ROHS,ISO,UL,IATF |
| Model Number: | As Per Customer's Model |
결제 및 배송 조건:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
|---|---|
| 가격: | Based On Gerber Files |
| Packaging Details: | Carton Or As Your Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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상세 정보 |
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| 제품명: | 맞춤형 다층 PCB | 가연성: | 예 |
|---|---|---|---|
| 전설: | 하얀색 | 라우팅: | 0.1mm |
| 최소 구멍 크기: | 0.10 밀리미터 | 전반적으로 구리: | 0.5-5oz |
| 레이어 수: | 1~30세 이상 | PCB 표준: | IPC 클래스 2 |
| 테스트 서비스: | AOI 기능 | 표면 마무리: | ENIG / OSP / HASL |
| 인용 파일: | 거버 파일 또는 BOM 목록(PCBA) | 배송 방법: | 항공으로, DHL/FedEx/UPS/TNT |
| 강조하다: | 4 layer ENIG PCB board,custom PCB for camera module,multilayer PCB with ENIG finish |
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제품 설명
8-Layer Double-Sided Gold-Plated PCB for Compact Electronics:
This 8-panel double-sided printed circuit board (PCB) features gold-plated pads, fine-pitch FPC connectors, and precision routing for compact electronic modules. Ideal for IoT, sensor, or embedded system prototyping, it offers reliable solderability, consistent signal integrity, and mass-production-ready panelization. Manufactured with strict quality control, it supports custom SMT assembly and is perfect for R&D, small-batch production, and electronic component testing.
Key Advantages of our Custom Multilayer PCB:
- 8-in-1 panel design for efficient SMT assembly, cutting production time & labor cost
- Gold-plated pads & FR-4 substrate for excellent solderability, oxidation resistance & long-term reliability
- High-precision fine-pitch routing for stable signal transmission, ideal for compact modules
- Versatile for prototyping & mass production, compatible with custom SMT assembly
- Standardized process reduces waste, lowers unit cost & ensures consistent quality
How to order Multilayer PCB?:
1.PCB Design Files
Gerber files, NC drill files, centroid/Pick and Place files, and BOM list.
2.Mechanical & Assembly Drawings
Overall dimension drawing, assembly diagram, FPC/connector positioning details, and silkscreen description.
3.Technical Specifications
Board thickness, layer count, surface finishing (gold plating etc.), trace width/spacing, and impedance control requirements.
4.Production & Quality Requirements
Panelization design, SMT assembly requirements, testing standards, order quantity, and packaging specifications.
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Factory showcase
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PCB Quality Testing
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Certificates and Honors
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