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4 Layer ENIG Surface Finishing Electronic Board Custom PCB for Connector Camera Module
商品の詳細:
| ブランド名: | Xingqiang |
| 証明: | ROHS,ISO,UL,IATF |
| Model Number: | As Per Customer's Model |
お支払配送条件:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
|---|---|
| 価格: | Based On Gerber Files |
| Packaging Details: | Carton Or As Your Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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詳細情報 |
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| 製品名: | カスタム 多層PCB | 可燃性: | はい |
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| 伝説: | 白 | ルーティング: | 0.1mm |
| 穴の大きさ: | 0.10mm | 全体的に銅: | 0.5-5オンス |
| レイヤー数: | 1 ～ 30+ | PCB標準: | IPCクラス2 |
| テストサービス: | AOI 機能 | 表面仕上げ: | ENIG/OSP/HASL |
| 見積ファイル: | ガーバーファイルまたはBOMリスト(PCBA) | 配送方法: | 航空、DHL / フェデックス / UPS / TNT |
| ハイライト: | 4 layer ENIG PCB board,custom PCB for camera module,multilayer PCB with ENIG finish |
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製品の説明
8-Layer Double-Sided Gold-Plated PCB for Compact Electronics:
This 8-panel double-sided printed circuit board (PCB) features gold-plated pads, fine-pitch FPC connectors, and precision routing for compact electronic modules. Ideal for IoT, sensor, or embedded system prototyping, it offers reliable solderability, consistent signal integrity, and mass-production-ready panelization. Manufactured with strict quality control, it supports custom SMT assembly and is perfect for R&D, small-batch production, and electronic component testing.
Key Advantages of our Custom Multilayer PCB:
- 8-in-1 panel design for efficient SMT assembly, cutting production time & labor cost
- Gold-plated pads & FR-4 substrate for excellent solderability, oxidation resistance & long-term reliability
- High-precision fine-pitch routing for stable signal transmission, ideal for compact modules
- Versatile for prototyping & mass production, compatible with custom SMT assembly
- Standardized process reduces waste, lowers unit cost & ensures consistent quality
How to order Multilayer PCB?:
1.PCB Design Files
Gerber files, NC drill files, centroid/Pick and Place files, and BOM list.
2.Mechanical & Assembly Drawings
Overall dimension drawing, assembly diagram, FPC/connector positioning details, and silkscreen description.
3.Technical Specifications
Board thickness, layer count, surface finishing (gold plating etc.), trace width/spacing, and impedance control requirements.
4.Production & Quality Requirements
Panelization design, SMT assembly requirements, testing standards, order quantity, and packaging specifications.
Factory showcase
PCB Quality Testing
Certificates and Honors
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