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Yellow Oil Bendable and High Temperature Resistant PCBs for Flexible Electronic Systems
제품 상세 정보:
| 브랜드 이름: | Flexible PCB Board |
| 인증: | ROHS, CE |
| Model Number: | Varies By Goods Condition |
결제 및 배송 조건:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
|---|---|
| 가격: | NA |
| Delivery Time: | 12-15 Working Day |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 80000㎡/Month |
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상세 정보 |
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| 제품명: | 유연한 PCB | 유연성: | 높은 |
|---|---|---|---|
| 최소 구멍 크기: | 0.1mm | 슬로더 마스크: | 노란색 |
| 용법: | 변하기 쉬운 | 두께: | 0.2-5.0mm |
| 핵심 자료: | FR-4 | 차원: | 맞춤형 |
| 표면 마무리: | HASL / ENIG / OSP | 보드 두께: | 1.2/1.6/1.0/0.8mm 또는 맞춤형 |
| 강조하다: | yellow oil flexible PCB,high temperature resistant PCB,bendable electronic system PCB |
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제품 설명
Antioxidant surface treatment flexible PCB:
One of the standout features of this Flexible PCB Board is its high flexibility. Unlike traditional rigid circuit boards, this flexible variant can bend, twist, and fold without compromising its electrical performance or structural integrity. This flexibility opens up new possibilities for innovative product designs, allowing engineers to create compact and complex electronic assemblies that were previously unattainable. The ability to conform to various shapes and surfaces makes it especially valuable in applications where space is limited or unusual geometries are involved.In addition to its flexibility, the board boasts a yellow soldermask, which not only provides a vibrant visual appeal but also enhances the protection of the conductive traces against oxidation, environmental contaminants, and mechanical abrasion. The yellow soldermask improves the overall durability and reliability of the PCB, ensuring long-lasting performance even in challenging operating conditions. This attribute plays a crucial role in maintaining signal integrity and preventing short circuits, thereby increasing the lifespan of the electronic components.
Key Characteristics of Flexible Printed Circuit Boards (FPCBs):
| Characteristic | Description |
| 1. Flexibility & Conformability | The defining feature. FPCBs can bend, fold, and twist to fit into irregular or constrained spaces, enabling 3D interconnection without external wiring. |
| 2. Thin Profile & Lightweight | Utilizing thin film substrates (like Polyimide, PI), FPCBs are significantly thinner and lighter than Rigid PCBs, crucial for portable and mobile devices. |
| 3. High Density Interconnection (HDI) | Capable of highly dense traces and small component mounting, supporting miniaturization and complex circuit integration. |
| 4. Dynamic Flexing Endurance | Designed to withstand millions of repeated bending cycles over their lifespan, essential for moving parts in devices (e.g., hinges, robotic arms). |
| 5. Space & Assembly Simplification | Reduces the need for multiple bulky connectors and wiring harnesses by integrating them onto a single flexible circuit, simplifying assembly and saving internal volume. |
| 6. Excellent Thermal Stability | The base materials (especially PI) offer superior heat resistance and reliability, allowing FPCBs to operate consistently in high-temperature environments. |
| 7. Improved Reliability | Less prone to failures caused by motion, vibration, and mechanical stress compared to traditional rigid circuits or discrete wiring. |
FPCB Manufacturing Process:
1.Laminate: Start with flexible Polyimide (PI) film bonded with Copper (CCL).2. Image & Etch: Apply circuit pattern using photolithography, then chemically remove unwanted copper to form traces.
3. Drill & Plate: Create connecting holes (Vias) and plate them with copper (PTH).
4. Protect (Coverlay): Apply a flexible protective film (Coverlay) over the circuit lines.
5. Finish & Cut: Apply surface finish (for soldering) and cut the final FPCB outline (Profiling).
6. Test: Perform final electrical and visual inspection.
