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Printed Circuit Board Lamination Manufacturing
Video Description
Join us for a close-up look at the manufacturing process of our FR4 OSP Surface Multilayer Printed Circuit Boards. In this video, you'll see how we laminate multiple conductive copper layers under high pressure and heat, explore the sophisticated assembly that enables high-density wiring, and learn about the key advantages that make these 4-layer PCBs ideal for complex, miniaturized devices. We'll also walk you through our factory showcase, quality testing procedures, and the simple steps to order your custom OEM/ODM boards.
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