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Tailored IC Substrate Panel Micron-Level Circuit PCB for Semiconductor Chip Packaging
Product Details:
| Brand Name: | Xingqiang |
| Certification: | ISO 9001 / RoHS /UL / CE / IATF 16949 (automotive) |
| Model Number: | Varies By Goods Condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
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| Price: | Based on Gerber Files |
| Packaging Details: | Packed As Per Customer |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Pcb: | Customized Multilaye PCB | Test Way: | 100% E-test |
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| Layer: | 1-30 Layers | Quotation Request: | Gerber Files |
| PCBA Customization: | BOM List | Max.board Size: | 528*600mm |
| PTH: | +/-0.075Mm | SMT Tech: | SMD, BGA, DIP, Etc. |
| Character: | White,Black,Yellow,Red | Panel Thickness: | 1.6/1.2/1.0/0.8mm Or Customized |
| Highlight: | micron-level circuit PCB for semiconductor,tailored IC substrate panel PCB,multilayer PCB for chip packaging |
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Product Description
Custom IC Substrate High Precision PCB for Semiconductor Packaging 4-8 Layers Array Panel:
We provide customized IC substrates, high‑precision packages that connect bare dies to main PCBs. These substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, line widths, pad layouts, and array formats to match your specific chip requirements, ensuring optimal performance and reliability.
Technical Parameters:
| SMT Technology | SMD, BGA, DIP, Etc. |
| Layer | 1-30 Layers |
| PCBA Standard | IPC-A-610 E Class II |
| PTH | ±0.075mm |
| Impedance Control | ±10% Or 5% |
| Thickness | 0.2mm-5.0mm |
| Surface | ENIG/HASL, OSP |
| Test Method | Probe Test / E-test |
| Material | FR4, Rogers, Polyimide |
| Min.hole Size | 0.1mm |
| Min Line Width | 3Mil |
What documents are needed for custom circuit board manufacturing?:
1. Gerber Files (Design Data)
• Gerber (.gbr) or ODB++ files.
• These are the standard industry files that contain all the layer information (copper, solder mask, silkscreen).
• Note: Please ensure the files are in RS-274X format.
2. Drill Files
• Excellon Drill File (.drl).
• This file specifies the location and size of all the holes (vias and component holes) on the board.
3. Bill of Materials (BOM)
• A list of all the components required for assembly.
• Include Part Numbers, Manufacturer Names, and the Quantity for each part.
4. Assembly Drawing
• A top/bottom view drawing showing the exact position of each component.
• This helps in verifying the placement and orientation of parts.
5. Technical Specifications (Specs)
• Layer Count: (e.g., 4 Layer, 6 Layer).
• Material: (e.g., FR-4, Rogers, ABF for IC Substrates).
• Copper Thickness: (e.g., 1oz, 2oz).
• Surface Finish: (e.g., HASL, ENIG, Immersion Gold).
• Board Dimensions: Length and width.
6. Additional Requirements
• Impedance Control: If specific impedance values are needed (e.g., 50 Ohms).
• Silkscreen: Any specific text or logos to be printed on the board.
• Packaging: Any special packaging instructions (e.g., vacuum packing).
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