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Double Sided HASL PCB OSP Surface Treatment FR4 Structure Customized Board
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Minannularring: | 0.2mm | Base Material: | FR4 |
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| Pcb Thickness: | 0.2mm-5.0mm | Special Requirement: | Impedance Control |
| Solder Mask: | Yellow PI Film, White, Black, Green,Red | Maximum Size: | 528mm*600mm |
| Cooper: | 1/1oz | Pcb Name: | Double Sided ENEPIG PCB |
| Test: | E-test/Fixture Text | Copper Thickness: | 1oz |
| Waterproof: | IP20 | Surface Finished: | LF-HASL |
| Usage: | Electronics | Treatment Finished: | OSP |
| Highlight: | Double Sided Tin Plated PCB,HASL Treatment Printed Circuit Board |
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Product Description
Double-sided tin-plated PCB, headphone board ear plate enquipment
Double-sided hot air solder leveling (HASL) PCB is a type of printed circuit board where both sides of the substrate are treated with the hot air solder leveling process, featuring practical performance and wide adaptability. Its core characteristics are as follows: The surface treatment involves uniformly covering the copper surface with molten tin-lead alloy (or lead-free tin alloy), which is then leveled by hot air to form a flat, bright tin layer with moderate thickness and strong adhesion. This process endows the board with excellent solderability, ensuring good wetting of the solder during component welding, reducing the risk of cold solder joints. Moreover, the tin layer allows for multiple rework soldering, making it suitable for mass assembly and later maintenance needs. Meanwhile, the tin layer has certain oxidation resistance and protective capabilities, which can protect the copper surface from environmental corrosion, extend the storage and service life of the board, and is particularly suitable for general industrial environments such as humid and dusty conditions.
Core Characteristics:
| Feature | Description |
| Layer Structure | Conductive copper layers on both top and bottom sides of the insulating substrate |
| Interconnection | Plated through-holes (vias) connect circuits between the two layers |
| Wiring Capacity | Double-sided routing enables higher wiring density and complex circuit layouts |
Key Advantages:
- Superior solderability: The tin layer ensures excellent wetting of solder during component welding, minimizing cold solder joints. It allows multiple rework soldering, adapting to mass assembly and post-maintenance requirements.
- Reliable protection: The tin coating provides oxidation resistance and corrosion protection for the copper surface, extending the board’s storage and service life, especially in general industrial environments (e.g., humid, dusty conditions).
- Practical efficiency: The mature and stable HASL process enables high production efficiency and controllable costs, making it a cost-effective choice for fields like consumer electronics, home appliances, and industrial control where a balance of welding reliability and economy is required.
