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Customized Flexible Printed Circuit Board for with Immersion Gold & OSP Surface Finish
Product Details:
| Brand Name: | Xing Qiang |
| Certification: | ISO 9001 / ROHS /UL / IATF 16949 (automotive) |
| Model Number: | As Per Customer's Model |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
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| Price: | NA |
| Packaging Details: | Carton Or As Per Customer's Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product Name: | Customized Flexible PCB | Place Of Orignial: | China |
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| Base Material: | Polymide | Minimum Line Width: | 0.075mm |
| Layercount: | 1 To 30 Layers | Heat Resisitant: | - 65℃~+150℃ |
| Solder Mask: | Black Or Tailored | Testing Standard: | IPC-A-610 E Class II |
| Price: | Based On Gerber Files | PCB Size: | According To Customer Request |
| Highlight: | customized flexible PCB board,immersion gold flexible PCB,OSP surface finish PCB |
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Product Description
Custom FPC Fabrication for Wearable & Medical Applications:
We specialize in custom flexible printed circuit (FPC) fabrication.We support surface finishes such as ENIG, HASL and OSP, and integrate advanced features like blind microvias, controlled impedance routing, and coverlay protection. Our panelized manufacturing ensures cost efficiency, while rigorous reliability testing (including flexural fatigue and thermal cycling) guarantees performance in dynamic applications like wearables and medical devices.Technical Parameters:
| Product Name | Custom PCB Board |
| Base Material | Polymide |
| PCB Size | As per your request |
| Copper Overall | 05-5oz |
| PTH | 0.075Mm |
| Minimum Line Spacing | 3Mil(0.075mm) |
| Min.hole Size | 0.1Mm |
| Silkscreen Color | White,Red,Black,Yellow |
| Solder Mask Ink Color | Black/Yellow/Red/White/Blue/Green |
| Size or Dimension | According To Customer Request |
Custom PCBs vs. Off-the-Shelf PCBs::
| Aspect | Custom PCBs | Off-the-Shelf PCBs |
|---|---|---|
| Design Flexibility | Fully customizable size, shape, layer count, and routing to match product requirements | Fixed dimensions, layouts, and features; limited to standard configurations |
| Performance & Features | Support HDI, microvias, controlled impedance, and specialized materials/finishes (ENIG, HASL, OSP) | Basic circuitry only; no advanced features, poor impedance control, limited material options |
| Space & Integration | Optimized for miniaturization, fits compact/irregular form factors (wearables, medical devices) | One-size-fits-all; bulky, wastes space, hard to integrate into slim designs |
| Reliability | Tailored for harsh environments, with rigorous testing (flex fatigue, thermal cycling) | Generic build; lower durability, higher failure risk in demanding applications |
| Cost Efficiency | Higher upfront tooling, but lower long-term costs via optimized assembly and mass production | Lower upfront cost, but higher assembly costs, compatibility issues, and redesign expenses |
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