すべてのカテゴリ
高密度アプリケーション向けの熱抵抗と省スペースを備えたカスタマイズ可能な FR4 材質 HDI PCB
Customizable FR4 Material HDI Multilayer PCB with Thermal Resistance & Space Saving Why Choose This Board HDI technology enables next-generation electronics by breaking space constraints while boosting electrical performance. As devices evolve toward smaller form factors with higher functionality, HDI PCBs provide the essential foundation for innovation in 5G, AI, IoT, and portable medical systems. Core Performance Advantages Miniaturization: 50-70% size/weight reduction vs.
カスタム高密度PCBボード 4/6層 FR-4素材 ミニブルートゥースデバイスに合わせた
Professional Custom HDI PCB ISO/IPC Certificated: Professional custom high-density interconnect PCB engineered for Bluetooth headset control modules. Featuring 4/6-layer FR-4 base, BGA compatibility and ENIG plating, our tailor-made boards offer exceptional signal integrity, anti-interference and long-term reliability. ISO/IPC compliant, fully customizable specs to fit miniaturized wireless audio applications. Why Choose Us: ✔ 30 Years’ Rigid-Flex & HDI PCB Expertise ✔ ISO
RoHS 認証済み、ワイヤレス ネットワークに合わせた高密度 PCB の静電気防止保護
Why Choose This High-Density PCB?: 1.Ultra-high integration & miniaturization – Fine traces, laser microvias, and blind/buried vias maximize wiring in limited space.2. Superior signal integrity – Impedance controlled, low-loss design ideal for high-speed/RF/wireless applications.3. Excellent reliability – High-Tg/thermal stable substrates and ENIG finish ensure durability and consistent performance.4. Fully customizable – Tailored layers, materials, and finishes to match your
高密度 8 層 HDI PCB 低接触抵抗 & 医療機器向け RoHS 準拠
What can we do for you? Xingqiang Circuit Board Technology, specialize in high-precision 8-layer custom PCBs with ENIG surface treatment and high-Tg FR-4 material. Our irregular profile PCBs are widely used in robot joints and precision medical equipment, featuring stable signal transmission, great heat resistance and EMI suppression. We offer full customization and reliable mass production support. Main Medical Devices Applications of HD PCB: Medical PCB Application Medical
12 層シンキングゴールド高密度 PCB はカスタム UAV PCB の振動に耐えます
Tired of Generic PCBs? Upgrade to Xingqiang’s Custom High-Density PCB Solutions: Xingqiang Circuit Technology specializes in custom PCBs like these high density boards. Our proprietary black solder mask and gold-plated transmission lines are engineered for superior RF performance, while our flexible manufacturing allows quick iterations and low-to-high volume production. Whether for communication or industrial applications, we deliver precision-engineered, corrosion-resistant
注文の多層の無線通信モジュールのための高密度 PCB 板の低損失
What can we do?: We offer custom high-density HD PCBs.Built with fine traces, laser microvias, and multilayer designs, they support device miniaturization and high-speed signal integrity. Available with ENIG/OSP/HASL surface finishes, impedance control, and reliable FR‑4 or low-loss substrates. All PCBs are IPC compliant, anti-static vacuum packed, and fully tailored to your Gerber, layer count, and performance specifications. Custom PCB vs. Off-the-Shelf PCB: Comparison Item
OEM 高密度 PCB 製造 ENIG 表面仕上げ&ブラインド埋め込みビア設計
What is an HD circuit board?: HD PCB (High Density PCB) is an advanced type of printed circuit board designed for high component density, miniaturization, and high-performance electronic devices.Compared to traditional PCBs, it features ultra-fine copper traces (line widths/spacings usually ≤ 0.1mm, even down to 0.03mm), tiny microvias (diameter ≤ 0.15mm, in blind/buried/stacked designs), and more layers (often 8–40+ layers). It also uses specialized materials (e.g., high
スマート ホーム デバイス用のカスタム高密度金メッキ FR-4 PCB マルチパネル
High-Density ENIG FR-4 Multi-Panel PCB Custom for WiFi & Wireless IoT Devices: This custom multi-panel PCB is specifically engineered for 2.4G/5G WiFi modules, built on high-quality FR-4 substrate with ENIG (Electroless Nickel Immersion Gold) surface finish. It features high-density routing and gold-plated pads, ensuring low signal loss, excellent solderability, and long-term reliability for IoT, smart home, and wireless communication devices. The multi-panel design optimizes
