Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service

Product Details:

Brand Name: High Frequency PCB
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number: As per Customer's Model

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 Pc(5 Square Meters)
Price: Based on Gerber Files
Delivery Time: NA
Payment Terms: T/T,Western Union
Supply Ability: 100000㎡/Month
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Detail Information

Features: High Density,Corrosion Resistant,Flame Retardant Product Name: Custom High-Frequency PCB
Min Holes Size: 0.1mm Min.Line Spacing: 3mil
Copper Overall: 0.5-5oz Min.Line Width: 0.075mm
Layers: 1-30 Layers SMT Technique: SMD, BGA, DIP, Etc.
Quotation Request: Gerber Or BOM List Silkscreen: White,Black,Yellow,Red
Solder Mask Color: Green,Red,Black,White,Blue,Yellow Standard Board Thickness: 1.6/1.2/1.0/0.8mm Or Customized

Product Description

What we can do?:

This custom rigid-flex PCB by XingQiang PCB Technology is engineered for wearable devices like smart watches & fitness trackers, adopting High Tg FR-4 rigid substrate + PI flexible material with ENIG gold-plated surface. Boasting ISO-certified quality, high integration, bendable design and anti-oxidation performance, it ensures stable signal transmission. With 30+ years of precision manufacturing, one-stop service and premium raw materials, we offer OEM/ODM customization per your exact model and design requirements for mass production.


What are the advantages of high-frequency PCB boards?:

1.Rigid-flex structure (High Tg FR-4 + PI), bendable & space-saving
2. ENIG gold-plated surface, oxidation/corrosion resistant
3. High-density multi-layer, 94V-0 flame retardant, high integration
4. Precise impedance control, stable medium-low frequency signal transmission
5. Customizable size/design, compatible with SMT precision soldering


 Rigid-Flex Circuit Board Manufacturing Process:

XingQiang’s custom rigid-flex PCB production flow:

1. Receive customer’s Gerber design/drawing for technical confirmation & optimization. 

2. Material cutting (High Tg FR-4/PI).

3. Rigid-flex layer processing: circuit imaging, etching, plating.

4. Lamination & pressing to form integrated structure.

5. Drilling, ENIG surface treatment, solder mask printing.

6. Precision testing (impedance, connectivity, bend performance).

7. Sample confirmation, mass production & final inspection, then delivery.

All steps follow strict quality control, matching your exact model requirements.



Rigid-Flex PCB ENIG Surface  FR-4 & PI Substrate Low Resistance OEM/ODM Service 0

         

          Factory showcase

Rigid-Flex PCB ENIG Surface  FR-4 & PI Substrate Low Resistance OEM/ODM Service 1


            PCB Quality Testing


Rigid-Flex PCB ENIG Surface  FR-4 & PI Substrate Low Resistance OEM/ODM Service 2


    Certificates and Honors

Rigid-Flex PCB ENIG Surface  FR-4 & PI Substrate Low Resistance OEM/ODM Service 3



Rigid-Flex PCB ENIG Surface  FR-4 & PI Substrate Low Resistance OEM/ODM Service 4

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this product

Rating Snapshot

The following is the distribution of all ratings
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100%
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All Reviews

L
Linh
Vietnam Mar 26.2026
The manufacturer's engineering department responded with remarkable speed; within just half an hour of our placing the order, they issued their DFM (Design for Manufacturability) review recommendations, helping us correct a minor oversight regarding the dimensions of the flexible PCB's stiffener.

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