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High Density PCB Board 4/6 Layers FR-4 Material Tailored for Mini Bluetooth Devices
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
|---|---|
| Price: | Based on Gerber Files |
| Packaging Details: | As per Customer's Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| PCB Name: | Custom High Density PCB Board | Material: | FR4 |
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| Copper Overall: | 0.5-5oz | Pcba Standard: | IPC Class 2 |
| Layers: | 1-30 Layers | Minimum Line Space: | 3mil (0.075mm) |
| Surface Finishing: | HASL/OSP/ENIG | Other Services: | ODM/OBM/PCBA |
| Quotation: | Based On Gerber Files | Board Thinkness: | 1.6mm/1.2mm/1.0mm/0.8mm Or Customized |
| Highlight: | Double Sided PCB Board 1.2mm Think,Green Oil Half Hole Plate PCB Board |
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Product Description
Professional Custom HDI PCB ISO/IPC Certificated:
Professional custom high-density interconnect PCB engineered for Bluetooth headset control modules. Featuring 4/6-layer FR-4 base, BGA compatibility and ENIG plating, our tailor-made boards offer exceptional signal integrity, anti-interference and long-term reliability. ISO/IPC compliant, fully customizable specs to fit miniaturized wireless audio applications.
Why Choose Us:
✔ 30 Years’ Rigid-Flex & HDI PCB Expertise
✔ ISO 9001/RoHS/ISO/TS16949 Certified Quality
✔ Custom 4/6-Layer FR-4 HDI Boards | ENIG | BGA Ready
✔ DFM & Impedance Simulation Engineering Support
✔ Global Express Shipping (DHL/FedEx/UPS) to US, EU, JP & AU
Custom HDI Advantages:
| Category | Key Advantages |
|---|---|
| Performance | Stable RF signal, strong anti-interference, low signal loss |
| Design | HDI microvias, BGA compatible, compact size, high wiring density |
| Quality | ENIG finish, anti-oxidation, IPC/ISO certified, long-term reliability |
| Customization | 4/6-layer FR-4, flexible specs, low MOQ for prototyping |
| Service | DFM/impedance support, fast turnaround, global express shipping |
| Assembly | Excellent solderability, ideal for SMT/BGA assembly |
| Cost | Cost-effective mass production, reduced rework rate |
Production Process:
1.Requirement Confirmation & Gerber Audit: Review customer Gerber files, BOM and technical inquiries; finalize all custom specifications including layer count, base material, ENIG surface finish, BGA layout, and HDI micro/blind/buried via requirements.
2. DFM Analysis & RF Impedance Simulation: Conduct professional Design for Manufacturability (DFM) check and impedance simulation.
3. Material Preparation & HDI Inner Layer Production: Prepare qualified FR‑4 raw materials and fabricate HDI inner layers with precise imaging, etching, and AOI inspection.
4. Multilayer Lamination & Outer Layer Processing: Perform layer lamination for 4/6-layer boards, followed by outer layer imaging, etching, and desmear processing.
5. ENIG Surface Treatment & Profile Milling: Apply ENIG (Electroless Nickel Immersion Gold) surface finish for better solderability and oxidation resistance; rout the board to custom outline and dimensions.
6. Electrical & Reliability Verification: Run electrical continuity/insulation test, impedance test, flying probe test, and reliability checks to meet IPC and customer quality standards.
7. Final Inspection, Packaging & Global Delivery: Complete final visual and dimensional inspection, conduct ESD‑safe packaging, and arrange global express shipment via DHL/FedEx/UPS.
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