• Black Oil Spray Double Sided Circuit Board FR4 Material HASL Finishing
Black Oil Spray Double Sided Circuit Board FR4 Material HASL Finishing

Black Oil Spray Double Sided Circuit Board FR4 Material HASL Finishing

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: NA
Delivery Time: 7-10 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 3000
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Detail Information

Min. Solder Mask Clearance: 0.1mm Pcba Standard: IPC-A-610E
Aspect Ratio: 20:1 Board Thinkness: 1.2mm
Minimum Line Space: 3mil (0.075mm) Surface Finishing: HASL/OSP/ENIG
Material: FR4 Product: Print Circuit Board
Board Size: Customized
Highlight:

Black Oil Spray Solder PCB

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FR4 Material Dual Sided PCB

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HASL Double Sided Circuit Board

Product Description

 Double-sided black oil spray solder PCB

Double-sided PCB, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.



Advantages of Double-sided PCB:

  • Increase the wiring space
  • Improve the circuit functional density 
  • The cost is relatively low 
  • Good electrical performance
  • Adapt to high integration requirements

Main Features


1.Surface Finish 

• Hot Air Solder Leveling (HASL) process

• Tin-lead alloy coating for enhanced solderability and reliability

Matte surface appearance

2.Solder Mask

• Black solder mask ink

• High contrast for better visual inspection

• Provides excellent protection for copper traces

• Cost-effectiveness

3.Economical manufacturing process

• Suitable for high-volume production

• Lower material and processing costs compared to other finishes

4.Applications

• Consumer electronics (e.g., smart home devices)

Industrial instruments

• Automotive electronics

• General-purpose PCB applications

5.Limitations

• Poor surface planarity

• Not recommended for fine-pitch components

• Lead-based process requires RoHS compliance

• Lead-free options available but at higher cost

 


Manufacturing process:

1.The base material is cut to the required size. Then, drilling is performed for inner and outer layers. The dry film process involves pre-treatment, film lamination, exposure, and development. Lamination includes black oxidation treatment, micro-etching, stack-up, and pressing. Copper reduction is used to thin down copper layers, followed by electroplating which includes horizontal electroplating and tin-lead electroplating.
2.Hole plugging involves printing, pre-baking, and post-baking. Solder mask application includes green solder mask printing, exposure, development, and post-curing. Gold plating is performed for nickel-gold plating on gold fingers and immersion gold. HASL is used to apply solder coating through hot air leveling process.
3.Profiling involves CNC milling and mold punching. Electrical testing includes electrical testing and AOI (Automated Optical Inspection). Finally, the process ends with final inspection, visual inspection, cleaning, and packaging.

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