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FR4 Material Multilayer HDI Thick Copper PCB Board Industrial Control 8 Layer PCB
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 14-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Layer: | Multilayer | Material: | FR-4 |
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| Copper Thickness: | 1/2oz-6oz | Min. Solder Mask Bridge: | 0.08mm |
| Testing: | Flying Probe Test | Solder Mask Color: | Green, Blue, Red, Black, White |
| Application: | Industrial Controls | Thickness: | 1.6±0.1mm |
| Min. Line Width/Spacing: | 0.1mm | Silkscreen Color: | White, Black, Yellow |
| Board Thickness: | 0.2-5.0mm | Min. Hole Size: | 0.1mm |
| Surface Finish: | HASL, ENIG, OSP | Testing Method: | Flying Probe, Fixture |
| Highlight: | FR4 Material Industrial 8 Layer PCB,HDI Thick Copper PCB Board |
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Product Description
8-layer HDI thick copper industrial control board PCB
product Description:
The 8-Layer Heavy Copper Industrial Control PCB is a high-performance printed circuit board engineered for demanding industrial control and power management applications. Designed to support complex industrial systems, it serves as a critical core component in heavy-duty machinery, industrial automation equipment, power controllers, and high-power industrial modules, enabling reliable electrical signal transmission, precise control command execution, and stable high-current power distribution.
At the heart of its design lies an 8-layer architecture integrated with heavy copper construction—a key feature that delivers exceptional performance advantages. The heavy copper traces (typically ≥3oz) enhance current-carrying capacity, making it ideal for handling high-power loads and minimizing voltage drop in power transmission paths. Meanwhile, the 8-layer structure enables sophisticated circuit integration, supporting high-density wiring configurations to accommodate complex control logic while optimizing signal routing and reducing electromagnetic interference (EMI).
Crafted with high-performance materials, including glass fiber-reinforced epoxy substrates with excellent thermal resistance and mechanical strength, the PCB ensures stability under extreme operating conditions. Its surface treatment—often featuring immersion gold finishing—provides superior oxidation resistance, reliable solderability, and long-term conductivity, while the robust solder mask coating enhances insulation protection and environmental resilience against moisture, dust, and chemical exposure.
1. 8-layer architecture enables high-density circuit integration and complex wiring.
2. Heavy copper layers deliver superior current-carrying capacity for high-power applications.
3. Enhanced thermal dissipation efficiency to prevent overheating during intensive operation.
4. Improved mechanical strength and structural stability for long-term reliability.
5. Excellent performance in harsh environments with resistance to temperature fluctuations and corrosion.
6. Optimized signal integrity with reduced interference for precise control operations.
