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Red Oil Double Sided PCB Board OSP Surface Treatment 0.4mm Thickness Versatile
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Mini Holes: | 0.1mm | Special Tech: | Impendance Control |
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| Special Requirement: | 25um Hole Copper | Impedance Control: | YES |
| Wire Inlet: | Right Angle Wire Inlet | Finished Copper Thickness: | 1/1OZ |
| Thickness: | 0.4mm | Finished Copper: | 35um |
| Pcb Base Material: | FR4 TG150 | Minconductivewidth: | 0.2mm |
| Min. Trace/Spacing: | 3mil | ||
| Highlight: | Red Oil Double Sided PCB Board,0.4mm Thickness Double Sided PCB Board,Double Sided PCB Board OSP Surface |
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Product Description
Red oil OSP double-sided board PCB
- Red oil solder mask + OSP treatment + double-sided structure: The red ink ensures stable insulation, striking visual distinction for circuit areas, and a distinct appearance; the ultra-thin (0.1-0.3μm) OSP film guarantees oxidation resistance and reliable solderability; the double-sided design supports bidirectional signal transmission.
- Layered functionality: Red solder mask isolates non-welding areas, while OSP-treated pads enable secure component bonding, with both working in tandem to maintain circuit integrity.
- Process compatibility: The combination of red ink solder mask and OSP treatment is stable, with good material compatibility, fitting seamlessly into standard production workflows.
• High-visibility identification: The bright red solder mask simplifies circuit inspection, fault diagnosis, and assembly verification, reducing human error in production and maintenance processes.
• Reliable solderability: The OSP film is easily removed during soldering, ensuring excellent solder wetting on copper surfaces, minimizing cold solder joints, and adapting to fine-pitch components like QFP.
• Effective protection: The red ink solder mask isolates the circuit from moisture, dust, and physical abrasion, while the OSP film prevents copper oxidation, extending the board’s storage and service life.
• Cost-effectiveness: The low-cost OSP process combined with economical red ink and standard double-sided substrate results in controllable production costs, suitable for cost-sensitive applications in consumer electronics and home appliances.
• Environmental friendliness: The OSP process uses non-toxic organic compounds, and red ink is typically eco-friendly, complying with environmental regulations and reducing hazardous waste.
• Dimensional precision: The thin OSP layer and red ink do not significantly alter the board’s thickness or flatness, maintaining precision for high-density double-sided circuit designs.
