Multi Layer Aluminum PCB Board Customized Thinkness Metal Core Versatile Usage

White Oil Multi Layer Alumnium PCB Versatile Usage

 Aluminum-based Substrate, also known as Metal Core PCB (MCPCB for short), is a circuit board based on aluminum alloy. Aluminum substrates are mainly used in electronic devices that require good thermal management. They have excellent heat dissipation properties and are ideal for high-power, high-heat-generating devices. Aluminum substrates are widely used, especially in LED lighting, power electronics, automotive electronics and other fields.

How to order our aluminum-based circuit boards?

Send us your customizable Files:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Noted:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc. 

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

Manufacturing process:

• Design phase: During the design phase, it is necessary to select the appropriate copper thickness, aluminum thickness, and insulation layer material based on the power requirements heat dissipation requirements of the circuit. The design should also consider the current carrying capacity, impedance control, and heat dissipation paths.
• Substrate preparation: Aluminum substrates are typically made of high-quality aluminum alloy materials as the metal base and are subject to surface treatment to remove the layer. Then, a layer of insulation (such as polyimide) is applied to the aluminum substrate to ensure electrical insulation and good thermal conductivity
• Copper plating and etching: On the insulation layer of the aluminum substrate, a thin copper layer is deposited using electroplating technology, and the circuit pattern is formed on the copper layer using photolithography and etching processes, completing the layout of the circuit board.
• Drilling and plating: Drilling and plating processes are used to form through-holes and blind holes, which are used to connect electronic components the circuit board during subsequent assembly processes.
• Surface treatment and assembly: After the circuit pattern and hole machining are completed, surface treatment (such as OSP, HASL,ENIG etc.) is out, and then the components are welded and installed to form a complete circuit board.
• Quality inspection: After the production is completed, the aluminum substrate needs to undergo strict quality inspection, including electrical performance test, thermal performance test and reliability test to ensure its stability and safety under high power conditions.

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