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Custom PCBA with HASL/OSP/ENIG Surface Process and FR4 Material for Industrial Automation in 1-30 Layers

Brand Name: Xingqiang
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number: As Per Customer's Model
Minimum Order Quantity: Sample,1 Pc(5 Square Meters)
Price: Based on BOM List
Standard Packaging: As Customer Requirements
Delivery Time: NA
Payment Terms: T/T,Western Union
Supply Ability: 100000㎡/Month
Product Details
Highlight:

Custom PCBA for industrial automation

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FR4 SMT PCB assembly

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HASL OSP ENIG surface process

Product Name: Custom PCBA
Material: FR4
Min Hole Size: 0.1mm
Routing: +/-0.1mm
Copper Thikckness: 0.5-5oz
Production Needed: BOM List
PTH: +/-0.075Mm
PCBA Standard: IPC Class 2
Layers: 1-30 Layers
Board Thickness: 0.2mm-5.0mm
Surface Treatment: HASL/OSP/ENIG
Silksceen: White,Black,Red,Yellow
Solder Mask: Black,Green,Red,White,Yellow,Blue
Product Description
HASL/OSP/ENIG Surface Process Custom PCBA for Industrial Automation FR4 SMT Assembly
OEM/ODM PCBA Manufacturer for Industrial Automation

PCBA, short for Printed Circuit Board Assembly, is a functional electronic component that integrates electronic parts (like chips, resistors, and capacitors) onto a pre-fabricated PCB (Printed Circuit Board). It serves as the "core nervous system" for nearly all electronic devices, enabling the transmission of electrical signals and power between components to realize specific functions—from simple operations (e.g., a remote control) to complex tasks (e.g., a car's engine control unit). Unlike a bare PCB (which is just a blank circuit board), a PCBA is a fully assembled, ready-to-use module that directly powers the functionality of end products.

Key Characteristics of PCBA
Characteristic Description (Features) Impact on Device
Functionality It is a fully functional circuit with all components (ICs, resistors, connectors, etc.) soldered on. Allows the electronic device to perform its intended task (e.g., process data, manage power).
Integration/Density Achieves high component density, especially with Surface-Mount Technology (SMT) and Multi-Layer Boards. Enables miniaturization and complex circuitry in small devices (e.g., smartphones, wearables).
Reliability Designed and manufactured to ensure stable, permanent electrical connections between components. Guarantees long-term stability and performance; critical in aerospace and medical fields.
Structure/Form Can be Rigid, Flexible (Flex), or a combination (Rigid-Flex), depending on the base PCB material. Dictates the device's physical shape, space utilization, and ability to withstand movement/bending.
Conductivity Uses etched copper traces and precise wiring to provide excellent signal integrity and power distribution. Supports high-speed signal transmission and efficient power delivery with minimal loss or interference.
Cost Efficiency Suitable for mass production through highly automated manufacturing and assembly processes. Reduces overall manufacturing costs of electronic products, making them affordable for consumers.
Core Production Challenges
  • Precision Control for Miniaturized Components: As components (e.g., 01005 chips) shrink, aligning them with tiny PCB pads and applying accurate solder paste volumes becomes difficult, increasing the risk of defects like bridging or missing parts.
  • Process Compatibility with Diverse Components: Mixing surface-mount (SMD) and through-hole (THT) components requires balancing reflow and wave soldering parameters, which can lead to uneven heating or component damage.
  • Defect Detection and Prevention: Tiny defects (e.g., micro-cracks in solder joints) are hard to spot with traditional inspection; advanced tools (AOI, X-ray) are needed, adding cost and process complexity.
  • Environmental Adaptation: Meeting reliability demands for harsh environments (e.g., automotive high temperatures, industrial vibration) requires specialized materials (e.g., high-temperature PCBs) and stricter process controls, raising production difficulty.
Custom PCBA with HASL/OSP/ENIG Surface Process and FR4 Material for Industrial Automation in 1-30 Layers 0
Factory showcase
Custom PCBA with HASL/OSP/ENIG Surface Process and FR4 Material for Industrial Automation in 1-30 Layers 1
PCB Quality Testing
Custom PCBA with HASL/OSP/ENIG Surface Process and FR4 Material for Industrial Automation in 1-30 Layers 2
Certificates and Honors
Custom PCBA with HASL/OSP/ENIG Surface Process and FR4 Material for Industrial Automation in 1-30 Layers 3
Custom PCBA with HASL/OSP/ENIG Surface Process and FR4 Material for Industrial Automation in 1-30 Layers 4
Overall Rating
5.0
★★★★★
★★★★★
Based on 50 reviews recently
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All Reviews
  • M
    Mateo
    Chile Apr 17.2026 trustpilot.com
    ★★★★★
    ★★★★★
    From file upload to having assembled boards in my hands in the USA took only 12 days. Unbelievable turnaround for a custom PCBA order.
  • I
    Ida
    Denmark Jan 5.2026 trustpilot.com
    ★★★★★
    ★★★★★
    The price is very reasonable for the quality provided. We compared several suppliers, and this one offers the best value for money.
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