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ENIG Surface UAV PCB Drone Circuit Board 1.6mm Thickness Lightweight design
Product Details:
| Brand Name: | UAV PCB |
| Certification: | ROHS,CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
|---|---|
| Price: | NA |
| Delivery Time: | 15-16 Working Day |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 10000㎡ |
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Detail Information |
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| Min. Trace Spacing: | 0.075mm | Surface Finish: | ENIG |
|---|---|---|---|
| Material: | FR-4 | Silkscreen Color: | White |
| Solder Mask Color: | Green | Min. Trace Width: | 3mil |
| Testing Method: | Flying Probe Test | Min. Hole Size: | 0.1mm |
| Min. Hole Spacing: | 3mil | Layers: | 4 |
| Copper Weight: | 1oz | Max. Board Size: | 528mm X 600mm |
| Thickness: | 1.6mm | ||
| Highlight: | ENIG Surface UAV PCB,Drone Circuit Board 1.6mm Thickness |
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Product Description
Drone Circuit Board
Drone circuit boards are circuit substrates installed in electronic components such as flight control systems, image transmission systems, electronic speed controllers, power distribution modules (PDB), GPS modules, sensors, communication modules, and cameras. They are responsible for functions such as signal processing, power conversion, and communication control.
Structural and Material Characteristics:
- Number of layers: Commonly 4-layer, 6-layer or even 8-layer multi-layer boards, used to meet the requirements of high-speed signals and power integrity.
- Materials: FR-4 is commonly used, and some high-end applications adopt polyimide (PI) or ceramic substrates to improve shock resistance and high-frequency characteristics.
Features:
- Lightweight design
- Vibration resistance and temperature resistance
- High integration
- EMI/EMC control
| Item | Consumer Drone | Industrial Drone | Military/Special Drone |
|---|---|---|---|
| Board material | Ordinary FR-4 | High TG FR-4 / PI | PTFE / Ceramic substrate / Rogers |
| Number of layers | 4~6 layers | 6~10 layers | 8~16 layers + HDI + blind and buried vias |
| Copper thickness | 1oz | 2~3oz | ≥3oz (high-power modules) |
| Surface treatment | OSP/Immersion Gold | Immersion Gold/Hot Air Solder Leveling/Anti-sulfurization Process | Immersion Gold/Immersion Silver/Three-proof Coating |
| Anti-interference ability | Medium | High | Extremely high (EMI/EMC reinforced design) |
| Applicable temperature range | 0~70℃ | -20~85℃ | -40~125℃ or higher |
| Communication functions | Bluetooth/WiFi/Image transmission, etc. | 4G/5G/Data transmission/RTK GPS | Encrypted communication/Radar/Electronic countermeasure links |
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