8 Layer HDI Industrial Control Circuit Board Multilayer Design PCB Board
Product Details:
Place of Origin: | China |
Brand Name: | xingqiang |
Certification: | ROHS, CE |
Model Number: | Varies by goods condition |
Payment & Shipping Terms:
Minimum Order Quantity: | 5 square meters |
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Price: | NA |
Delivery Time: | 14-15 work days |
Payment Terms: | ,T/T,Western Union |
Supply Ability: | 3000㎡ |
Detail Information |
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Min. Trace Width: | 3mil | Solder Mask Color: | Green |
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Min. Hole Spacing: | 0.1mm | Copper Thickness: | 1oz |
Characteristic: | 6 Laser, 6 Lamination, 6+N+6 | Surface Finish: | HASL,OSP |
Impedance Control: | No | Layer: | 2 |
Silkscreen Color: | White | Testing: | Flying Probe Test |
Thickness: | 1.6mm | Testing Method: | Flying Probe |
Min. Hole Size: | 0.1mm | Internal Model: | C654004C16 |
Application: | Industrial Control | ||
Highlight: | HDI Industrial Control Circuit Board,8 Layer Industrial Control Circuit Board,Multilayer Design Industrial Circuit Board |
Product Description
8-layer HDI industrial control board PCB
Advantages of Industrial Control PCB:
- High reliability and stability
- Adaptability to harsh environments
- Enhanced system integration
- Excellent thermal management capability
- High resistance to temperature and chemicals
product Features:
- Superior reliability
- High temperature resistance and electromagnetic interference (EMI) resistance
- Enhanced durability with an extended service life
- Support for high-density integration and multi-layer design implementation
- Moisture and water resistance
- Capability to meet high-power requirements
Manufacturing process:
- Material Selection: Industrial control PCBs typically employ high-performance base materials, such as high-temperature-resistant substrates and glass fiber-reinforced epoxy resins. These materials ensure structural stability in environments characterized by high temperatures, high humidity, and chemical corrosion.
- Circuit Design and Layout: Industrial control PCB design incorporates comprehensive considerations including power management, signal integrity, and electromagnetic interference (EMI) mitigation. Circuit layouts require rational planning to guarantee robust electrical connectivity.
- Multilayer Design and Stacking Technology: Industrial control PCBs frequently adopt a multilayer architecture, integrating multiple circuit layers via precise stacking. This approach enables high-density wiring while minimizing signal crosstalk and spatial footprint.
- Thermal Management Design: To prevent thermal overload during high-power operation, industrial control PCBs integrate specialized thermal dissipation mechanisms. These include heat pipes, heat sinks, and thermally conductive materials, designed to facilitate efficient heat dissipation during operation.
- Protective Coating and Encapsulation: To bolster resistance to moisture, dust, and chemical corrosion, industrial control PCBs are often treated with protective coatings (such as polyurethane and epoxy resin) or employ specialized encapsulation methodologies.
- Testing and Verification: Throughout the production cycle, industrial control PCBs undergo rigorous electrical testing, functional validation, and environmental adaptability assessments. These procedures serve to validate product reliability and operational stability.
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