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FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications
Dettagli:
| Marca: | Xingqiang |
| Certificazione: | ISO 9001 / RoHS /UL / IATF 16949 |
| Model Number: | As Per Customer's Model |
Termini di pagamento e spedizione:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
|---|---|
| Prezzo: | Based On Gerber Files |
| Packaging Details: | Carton Or As Your Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Informazioni dettagliate |
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| Tipo scheda PCB: | Scheda PCB FPC | Materail: | FR-4 |
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| Spessore del rame: | 0.5-5oz | Strato: | 1-30 strati |
| Controllo dell'impedenza: | +/-10% o +/-5% | L'altro oggetto: | PCBA/ODM/OEM PCB |
| Richiesta di preventivo: | File Gerber o elenco BOM | Spessore del pannello: | 2,0/1,6/1,2/1,0/0,8/0,6/0,4/0,2 mm |
| Silkscreen Color: | Bianco, Nero, Blu, Giallo, Rosso, Verde | Imballaggio: | Imballaggio a vuoto con scatola di cartone |
| Evidenziare: | FR4 PCB board for power supply,ENIG surface treatment PCB,multilayer FPC PCB board |
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Descrizione di prodotto
Flexible Printed Circuit Board for Industrial & Consumer Electronics:
This is a 4-layer flexible printed circuit board (FPC) designed for power supply applications. Made of high-performance polyimide (PI) material with ENIG surface finish, it features excellent flexibility, high temperature resistance, and strong anti-interference ability. Lightweight, bendable, and highly reliable, it is widely used in consumer electronics, wearables, industrial control, automotive electronics, and IoT devices to achieve stable power transmission, signal connection, and optimized internal space layout.Customization PCB Service:
How to start your project?
• Gerber files (including layers, drills, silkscreen, solder mask)
• PCB assembly BOM list with component specifications
• Centroid (Pick and Place) coordinates file
• Mechanical drawing with dimensions and tolerances
• Schematic diagram and special process requirements
Professional FPC Production Process:
• Material preparation: PI base material and copper foil preparation
• Circuit patterning: Exposure, development and etching to form circuits
• Drilling & plating: Via hole drilling and electroplating for conduction
• Surface treatment: ENIG / OSP to improve solderability and anti-oxidation
• Coverlay lamination & solder mask coating for insulation protection
• Punching / cutting: Forming final outline and bending areas
• Electrical testing: Open / short test and performance verification
• Final inspection, packaging and shipment
Factory showcase
PCB Quality Testing
Certificates and Honors
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