two sided printed circuit board

IPC 2 Standard High-Frequency PCB: A high-frequency PCB is a specialized printed circuit board compliant with IPC 2 standards, engineered for high-speed, high-frequency electronic applications. It ensures minimal signal loss, reduced electromagnetic interference, and superior signal integrity, balancing performance, reliability and cost-effectiveness for advanced electronic devices. High-Frequency PCB Core Features: Feature Category Specific Characteristics Signal Performance

Custom Green Solder Mask PCBs – Tailored for All Your Electronic Projects Our custom green solder mask printed circuit boards (PCBs) are precision-engineered for durability and reliable performance across consumer electronics, industrial controls, and custom devices. Featuring optimized routing, clean component footprints, and precisely placed holes, these boards ensure seamless component integration. Fully customizable to your exact specifications, they deliver consistent

Panelized Rigid-Flex PCBs – Durable, Bendable, and Corrosion Resistant This is a panel of custom rigid-flex printed circuit boards (PCBs) , integrating rigid FR-4 substrates (green) and flexible polyimide sections (brown). Designed for high-density, space-constrained electronics, they provide robust mechanical support via rigid areas and dynamic bendability via flex regions, ideal for wearable devices, medical equipment, and compact IoT products. The ENIG (gold) surface

Premium High Frequency PCB for Advanced Electronic Devices: The High Frequency PCB is a specialized printed circuit board designed to meet the demanding requirements of high-speed and high-frequency electronic applications. Classified under IPC 2 standards, this PCB offers a perfect balance of performance, reliability, and cost-effectiveness, making it an ideal choice for a wide range of advanced electronic devices. It is engineered to support high-frequency signal transmissi

Black oil spray tin double panel PCB: ​ Black oil spray tin double panel PCB is a double-sided printed circuit board integrating black solder mask and double-sided spray tin (hot air solder leveling, HASL) surface treatment. It adopts a double-sided wiring design: the substrate (usually standard FR-4) is coated with black ink as the solder mask, which provides insulation, protects the circuit, and offers excellent light-shielding properties. Both sides of the board undergo

PCB multicouche FR4 de taille personnalisée avec 4 à 22 couches, 1,72 mm d'épaisseur et un rapport hauteur/largeur de 20:1. Présente plusieurs couleurs de masque de soudure, les certifications RoHS/ISO/UL/IATF et prend en charge SMT pour des performances fiables dans les applications industrielles.

XingQiang PCB – Strictly Tested for Industrial Electronics: XingQiang Industrial Custom Printed Circuit Board is designed for high-performance industrial control, automation equipment, new energy, IoT gateways, and intelligent electronic systems.XingQiang provides a one‑stop PCB solution from engineering evaluation, rapid prototyping, to mass production and assembly.Every board undergoes strict electrical testing, AOI inspection, and quality control to ensure consistency and

4 Layer ENIG Surface Finishing Electronic Board Custom PCB for Connector Camera Module 8-Layer Double-Sided Gold-Plated PCB for Compact Electronics This 8-panel double-sided printed circuit board (PCB) features gold-plated pads, fine-pitch FPC connectors, and precision routing for compact electronic modules. Ideal for IoT, sensor, or embedded system prototyping, it offers reliable solderability, consistent signal integrity, and mass-production-ready panelization. Manufactured

What are the advantages of rigid-flex PCBs? A flex-rigid PCB is a hybrid circuit board that combines rigid FR-4 sections with flexible polyimide (PI) regions in a single structure. It provides the mechanical stability of a rigid PCB for component mounting while allowing the flexible part to bend, fold, or twist to fit into tight or irregular spaces. This design reduces the need for connectors and cables, improves reliability, and enables 3D packaging in compact electronic