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Custom Muliti-layer PCB HASL/ENIG/OSP Surface Finish UL Certified DFM Analysis
Brand Name:
Xingqiang
Certification:
ROSH,ISO,UL,IATF
Model Number:
As Per Customer's Model
Minimum Order Quantity:
Sample,1 Pc(5 Square Meters)
Price:
Based On Gerber Files
Standard Packaging:
Carton Or As Your Request
Delivery Time:
NA
Payment Terms:
,T/T,Western Union
Supply Ability:
100000㎡/Month
Product Details
Highlight:
Custom multilayer PCB HASL finish
,UL certified multilayer PCB board
,Multilayer PCB with DFM analysis
PCB Type:
Custom Muliti-layer PCB
Minimum Line Width:
3mil (0.075mm)
Minimum Hole Diameter:
0.10 Mm
Custom Layer:
1-30 Layers
PTH:
+/-0.075Mm
NPTH:
+/-0.05Mm
Surface Plating:
HASL/ENIG/OSP
Quotation Files:
Gerber Files Or BOM List
Testing:
Probe Test / 100% E-test
Solder Mask:
White Green, Blue,Black,Yellow,red
Product Description
XingQiang Custom Multilayer PCB:
XingQiang Circuit Board Technology provides custom multilayer PCBs designed for camera modules, surveillance, and industrial vision systems. We support 4–8 layer high-density BGA boards with FR‑4 high Tg material, ENIG surface finishing, and strict compliance with RoHS, UL94 V‑0, and IPC standards. Fully customizable in layer count, impedance, and layout to meet your project requirements.
Technical Parameters:
| PCB Name | Custom Muliti-layer PCB |
| Special | Can Be Customized |
| PTH | +/- 0.075mm |
| Surface Plating | ENIG/HASL/OSP |
| Minimum Hole | 0.10 mm |
| Testing | Probe Test / 100% E-test |
| OEM Service | Yes |
| Copper Overall | 0.5-5oz |
| Layer Count | 2-layers,4 layers,6 layers,8 layers or Tailored |
Help Us Serve You Better: File Submission List:
• Gerber files (RS-274X format)
• PCB layer stackup & material specification
• Drilling files & netlist file
• BOM list for assembly service
• Silkscreen & solder mask design
• Special requirements: impedance, testing, certification
Factory showcase
PCB Quality Testing
Certificates and Honors
Overall Rating
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
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PActual testing reveals that under high-power operation, the thermal radiation efficiency of black ink is marginally superior to that of light-colored inks; however, this also imposes more stringent requirements on the design.
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PActual testing reveals that under high-power operation, the thermal radiation efficiency of black ink is marginally superior to that of light-colored inks; however, this also imposes more stringent requirements on the design.
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GThe ENIG finish is uniform and shows good solder wetting. No signs of "black pad" or oxidation upon arrival. The pads remained flat after two reflow cycles.
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