multilayer pcb

Custom IC Substrate High Precision PCB for Semiconductor Packaging 4-8 Layers Array Panel: We provide customized IC substrates, high‑precision packages that connect bare dies to main PCBs. These substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, line widths, pad layouts, and array formats to match your specific chip requirements, ensuring optimal performance and

Custom FR-4 Circuit Board for OEM/ODM Electronics: Custom Wireless Charging PCB Panel – 30 tailored modules for your unique electronic products. Fully customizable to match your device’s form factor and functional needs, this panelized PCB integrates reliable Qi-standard wireless charging technology. Made with high-quality FR-4 material and certified by RoHS/ISO, it ensures safe, efficient power transfer. Perfect for OEM/ODM projects, the panel design streamlines mass

Xingqiang Custom 2/4-Layer with ENIG & OSP Finish: Xingqiang PCB Technology delivers high-quality custom PCBs. Our 2/4-layer PCBs feature precision routing, robust pad design, and premium surface finishes including ENIG and OSP, ensuring excellent bonding strength and solderability. Made from high-performance FR-4 materials, they offer stable electrical performance, good heat dissipation, and wide temperature tolerance. Suitable for automotive displays, industrial control

Custom Multilayer PCBs High-TG FR-4, ENIG/OSP Surface Finish for Military Use Custom Military-Grade PCB Manufacturing Extreme Environment & EMI Resistant Xingqiang specializes in custom military-grade printed circuit boards (PCBs) engineered exclusively for defense, aerospace, and mission-critical applications, including avionics, battlefield communications, and missile guidance equipment. Our custom PCBs are built with outstanding resistance to extreme temperatures, shock,

CustomMulitilayer PCB: Your Design, Our Precision Build: Tailored to your exact design specs, this high-frequency PCB features a durable blue solder mask and sinking gold contacts for reliable signal performance. Its unique design to fit your device’s enclosure, making it ideal for wearables, IoT sensors, and specialized wireless modules. We turn your unique ideas into functional, production-ready PCBs. Why Choose Us?: • 30 years of professional PCB manufacturing experience •

Double-Sided FR-4 Printed Circuit Board for Industrial Control & Power Supply: Xingqiang Circuit Board Technology Co., Ltd. specializes in manufacturing high-quality double‑sided FR‑4 printed circuit boards. Our 2‑layer PCBs feature stable performance, excellent insulation, flame‑retardant materials, and lead‑free surface finishes such as HASL and OSP. With strict quality inspection and full electrical testing, our products meet RoHS, UL and ISO9001 standards, widely used in

Custom ENIG finish HDI PCB: ENIG HDI PCB combines high-density interconnect technology with a premium immersion gold finish. It offers excellent flatness, stable impedance control, and strong corrosion resistance, making it perfect for high-frequency and miniaturized electronic devices. Why Choose Us?: ✔ 30 Years Expertise in PCB Manufacturing ✔ ISO 9001, ROHS, and ISO /TS16949 Certified ✔ Support customized services ✔ Professional Engineering Support (DFM, impedance

Flexible Printed Circuit Board for Industrial & Consumer Electronics: This is a 4-layer flexible printed circuit board (FPC) designed for power supply applications. Made of high-performance polyimide (PI) material with ENIG surface finish, it features excellent flexibility, high temperature resistance, and strong anti-interference ability. Lightweight, bendable, and highly reliable, it is widely used in consumer electronics, wearables, industrial control, automotive

HDI PCBs: The Ideal Choice for High-Speed High-Frequency Applications HDI PCB (High-Density Interconnect Printed Circuit Board) is a high-performance circuit board with higher connection density, smaller microvias, and finer line widths than traditional PCBs. It uses blind, buried, and stacked vias to save space, supports miniaturized electronic devices, and ensures excellent signal transmission for high-speed, high-frequency applications. Core Manufacturing Challenges Ultra