automotive pcb board

Flexible Printed Circuit Board for Industrial & Consumer Electronics: This is a 4-layer flexible printed circuit board (FPC) designed for power supply applications. Made of high-performance polyimide (PI) material with ENIG surface finish, it features excellent flexibility, high temperature resistance, and strong anti-interference ability. Lightweight, bendable, and highly reliable, it is widely used in consumer electronics, wearables, industrial control, automotive

​Custom IPC Class 2 PCB Manufacturer for Automotive & Industrial Use This high-precision multilayer PCB from Xingqiang Circuit Board Technology features an immersion gold finish, IPC Class 2 compliance, and automotive-grade reliability. Leveraging advanced lamination, precision drilling, and strict quality control under IATF 16949, our boards deliver exceptional signal integrity and durability for automotive electronics, industrial controls, and high-end devices. With custom

Lightweight Double Sided Blue Glue PCB: Ideal for Demanding Applications: The double-sided blue glue PCB is a versatile, reliable, and lightweight circuit board that outperforms single-sided boards in design flexibility and layout efficiency. Made with premium materials and advanced manufacturing techniques, it meets top industry standards for durability and supports diverse surface finishes (including HASL, lead-free, gold, OSP) for strong solderability and corrosion

OSP halogen-free flame Retardant Double Sided PCB OSP halogen-free flame retardant 2-layer boards, these are printed circuit boards (PCBs) with circuit connections on both sides. In such PCBs, electronic and circuit layouts can be arranged separately on both sides of the PCB, with electrical connections between the two sides of the circuit realized through vias (Vias). This structure enhances the functional density of the circuit board, allowing it to achieve more circuit

Dual-Layer Circuit Board with Blue Oil OSP Surface Treatment Double-sided blue oil OSP process , also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional

4-layer solder mask custom FR4 custom multilayer board PCB 4-layer solder mask custom FR4 custom multilayer board PCB is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more

White Oil Multi Layer Alumnium PCB Versatile Usage Aluminum-based Substrate, also known as Metal Core PCB (MCPCB for short), is a circuit board based on aluminum alloy. Aluminum substrates are mainly used in electronic devices that require good thermal management. They have excellent heat dissipation properties and are ideal for high-power, high-heat-generating devices. Aluminum substrates are widely used, especially in LED lighting, power electronics, automotive electronics

Premium Blue FR4 Multilayer PCBs: High Density & Reliability: FR4 custom blue solder mask multilayer PCB is a high-performance circuit board. It uses FR4 epoxy fiberglass as the substrate for excellent insulation and durability. The blue solder mask protects the circuit and prevents solder bridges during assembly. Customized multilayer designs (like 4, 6, or 8 layers) are tailored to specific electronic requirements, widely used in consumer electronics, industrial controls,

Turnkey Flex-Rigid PCB Solution: Integrated Circuits & Stiffener Frames Custom high‑performance flex‑rigid PCBs with integrated component assembly. Our solution combines ENIG‑finished rigid FR‑4 areas with durable polyimide flex circuits, allowing you to integrate complex components such as fine‑pitch BGA chips, high‑speed connectors, and EMI filters directly onto the board. You can fully customize layer counts (1–30+ layers), pad sizes, via types (through‑hole, blind, buried