Xingqiang High-Tg PCB Solutions Empower European Industrial Automation Equipment to Withstand Extreme Thermal Stress

As industrial automation and 5G infrastructure accelerate, global Tier-1 clients require PCBAs that can withstand extreme thermal stress without delamination. A major European client recently sought a solution for high-power industrial converters capable of 24/7 operation in unventilated environments.

• Target: European Industrial Automation Manufacturer.

• Application: High-efficiency power supply modules for harsh factory environments.

• Pain Point: Previous boards using standard FR-4 (Tg 130°C) suffered from via-cracking and dimensional instability due to sustained thermal cycling during lead-free reflow and operation.

To ensure "Full Lifecycle Reliability," we transitioned the project from entry-level materials to a high-tier stack-up:

• Core Material: High-Tg FR-4

• Key Parameters:

  • Tg (Glass Transition Temperature): ≥175°C (Ensures rigid "glassy state" during high-temp peaks).

  • T288 (Time to Delamination): > 60minutes.

  • CTE (Coefficient of Thermal Expansion): Z-axis expansion reduced to 2.2%, critical for protecting small-diameter NPTH and microvias.

• Surface Finish: ENIG (Electroless Nickel Immersion Gold) for superior oxidation resistance and soldering flatness.

We utilized precision drilling and high-pressure oscillating nozzles to eliminate solder mask residue in NPTH—a common defect in complex industrial layouts.

The client reported a 0% failure rate across the first 5,000 units during thermal stress testing ( -40°C to +125°C). They specifically commended our transparency in material sourcing and our ability to navigate "sensitive" technical specifications for international export.

At Xingqiang, we move beyond "functional realization" to "environmental adaptation." Whether it's Rogers  for 5G RF or High-Tg FR-4 for industrial power, our material selection logic is driven by data and reliability, ensuring your products thrive in the global market.